Semiconductor light emitting element

ABSTRACT

According to one embodiment, a semiconductor light emitting element ( 110 ) includes a metal layer ( 40 ), a first to a fourth semiconductor layers ( 10   a,    20   a,    10   b,    20   b ), a first and a second light emitting layers ( 30   a,    30   b ), a first to a sixth electrodes (e 1 -e 6 ), and a first inter-element interconnect section ( 12 ). The first semiconductor layer ( 10   a ) includes a first to a third regions (r 1 -r 3 ). The second semiconductor layer ( 20   a ) is provided between the first region (r 1 ) and the metal layer ( 40 ) and between the second region (r 2 ) and the metal layer ( 40 ). The third semiconductor layer ( 10   b ) includes a fourth to a sixth regions (r 4 -r 6 ). The fourth semiconductor layer ( 20   b ) is provided between the fourth region (r 4 ) and the metal layer ( 40 ) and between the fifth region (r 5 ) and the metal layer ( 40 ). The first inter-element interconnect section ( 12 ) is provided between the second electrode (e 2 ) and the metal layer ( 40 ) and between the sixth electrode (e 6 ) and the metal layer ( 40 ).

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a National Stage application of International Application No. PCT/JP2015/003770, filed on Jul. 28, 2015. The present application also claims foreign priority to Japanese Application Nos. 2014-161208, filed Aug. 7, 2014, and 2015-027958, filed Feb. 16, 2015, respectively.

TECHNICAL FIELD

Embodiments of the invention described herein relate to a semiconductor light emitting element.

BACKGROUND ART

It is desirable to increase the efficiency of semiconductor light emitting elements such as light emitting diodes (LEDs: Light Emitting Diodes), etc.

SUMMARY OF INVENTION Technical Problem

Embodiments of the invention provide a highly efficient semiconductor light emitting element.

Solution to Problem

According to one embodiment of the invention, a semiconductor light emitting element includes a metal layer, a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a first light emitting layer, a third semiconductor layer of the first conductivity, a fourth semiconductor layer of the second conductivity, a second light emitting layer, a first to a sixth electrodes and a first inter-element interconnect section. The first semiconductor layer is separated from the metal layer in the first direction. The first semiconductor layer includes a first region, a second region, and a third region. The second region is separated from the first region in a second direction intersecting the first direction. The first region, the second region, and the third region extend in a third direction intersecting the first direction and the second direction. The third region is provided between the first region and the second region. The second semiconductor layer is provided between the first region and the metal layer and between the second region and the metal layer. The first light emitting layer is provided between the first region and the second semiconductor layer and between the second region and the second semiconductor layer. The third semiconductor layer is separated from the metal layer in the first direction and arranged with the first semiconductor layer in the second direction. The third semiconductor layer includes a fourth region, a fifth region, and a sixth region. The fifth region is separated from the fourth region in the third direction. The fourth region, the fifth region, and the sixth region extend in the second direction. The sixth region is provided between the fourth region and the fifth region. The fourth semiconductor layer is provided between the fourth region and the metal layer and between the fifth region and the metal layer. The second light emitting layer is provided between the fourth region and the fourth semiconductor layer and between the fifth region and the fourth semiconductor layer. The first electrode is provided between the second semiconductor layer and the metal layer in the first region and electrically connected to the second semiconductor layer. The second electrode is provided between the second semiconductor layer and the metal layer in the second region and electrically connected to the second semiconductor layer. The third electrode is provided between the third region and the metal layer and electrically connected to the third region. The fourth electrode is provided between the fourth semiconductor layer and the metal layer in the fourth region and electrically connected to the fourth semiconductor layer. The fifth electrode is provided between the fourth semiconductor layer and the metal layer in the fifth region and electrically connected to the fourth semiconductor layer. The sixth electrode is provided between the sixth region and the metal layer and electrically connected to the sixth region. The first inter-element interconnect section is provided between the second electrode and the metal layer and between the sixth electrode and the metal layer. The first inter-element interconnect section electrically connects the second electrode to the sixth electrode.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic perspective plan view showing a semiconductor light emitting element according to a first embodiment.

FIG. 2 is a schematic cross-sectional view showing the semiconductor light emitting element according to the first embodiment.

FIG. 3 is a schematic cross-sectional view showing the semiconductor light emitting element according to the first embodiment.

FIG. 4 is a schematic cross-sectional view showing the semiconductor light emitting element according to the first embodiment.

FIG. 5 is a schematic perspective plan view showing a semiconductor light emitting element according to a second embodiment.

FIG. 6 is a schematic cross-sectional view showing the semiconductor light emitting element according to the second embodiment.

FIG. 7 is a schematic cross-sectional view showing the semiconductor light emitting element according to the second embodiment.

FIG. 8A to FIG. 8D are drawings showing portions of the semiconductor light emitting element according to the second embodiment.

FIG. 9 is a schematic perspective plan view showing a semiconductor light emitting element according to a third embodiment.

FIG. 10 is a schematic cross-sectional view showing the semiconductor light emitting element according to the third embodiment.

FIG. 11 is a schematic cross-sectional view showing the semiconductor light emitting element according to the third embodiment.

FIG. 12 is a schematic perspective plan view showing a semiconductor light emitting element according to a fourth embodiment.

FIG. 13A to FIG. 13E are schematic plan views showing electrodes and interconnects of the semiconductor light emitting element according to the embodiment.

FIG. 14A to FIG. 14E are schematic plan views showing electrodes and interconnects of one other semiconductor light emitting element according to the embodiment.

FIG. 15A and FIG. 15B are schematic plan views showing the interconnect structure of another semiconductor light emitting element according to the embodiment.

FIG. 16A and FIG. 16B are schematic plan views showing interconnect structures of another semiconductor light emitting element according to the embodiment.

FIG. 17A to FIG. 17H are schematic cross-sectional views showing a method for manufacturing the semiconductor light emitting element according to the embodiment.

FIG. 18A to FIG. 18E are schematic cross-sectional views showing a method for manufacturing the semiconductor light emitting element according to the embodiment.

FIG. 19 is a schematic cross-sectional view showing a semiconductor light emitting element according to a fifth embodiment.

FIG. 20 is a schematic cross-sectional view showing a semiconductor light emitting element according to a fifth embodiment.

FIG. 21 is a schematic cross-sectional view showing a semiconductor light emitting element according to a fifth embodiment.

FIG. 22 is a schematic cross-sectional view showing a semiconductor light emitting element according to a fifth embodiment.

FIG. 23 is a schematic cross-sectional view showing a semiconductor light emitting element according to a sixth embodiment.

FIG. 24 is a schematic cross-sectional view showing a semiconductor light emitting element according to a sixth embodiment.

FIG. 25A to FIG. 25D are drawings showing a portion of the semiconductor light emitting element according to the sixth embodiment.

FIG. 26 is a schematic cross-sectional view showing a semiconductor light emitting element according to a seventh embodiment.

FIG. 27 is a schematic cross-sectional view showing a semiconductor light emitting element according to a seventh embodiment.

FIG. 28 is a schematic perspective plan view showing a semiconductor light emitting element according to an eighth embodiment.

FIG. 29A and FIG. 29B are schematic cross-sectional views showing the semiconductor light emitting element according to the eighth embodiment.

FIG. 30 is a schematic cross-sectional view showing the semiconductor light emitting element according to the eighth embodiment.

FIG. 31A and FIG. 31B are schematic cross-sectional views showing the semiconductor light emitting element according to the eighth embodiment.

FIG. 32 is a schematic perspective plan view showing a semiconductor light emitting element according to a ninth embodiment.

FIG. 33 is a schematic cross-sectional view showing the semiconductor light emitting element according to the ninth embodiment.

FIG. 34 is a schematic cross-sectional view showing the semiconductor light emitting element according to the ninth embodiment.

FIG. 35 is a schematic perspective plan view showing a semiconductor light emitting element according to a tenth embodiment.

FIG. 36 is a schematic cross-sectional view showing the semiconductor light emitting element according to the tenth embodiment.

FIG. 37 is a schematic cross-sectional view showing the semiconductor light emitting element according to the tenth embodiment.

FIG. 38 is a schematic perspective plan view showing a semiconductor light emitting element according to an eleventh embodiment.

DESCRIPTION OF EMBODIMENTS

Various embodiments of the invention will be described hereinafter with reference to the accompanying drawings.

The drawings are schematic or conceptual; and the relationships between the thicknesses and widths of portions, the proportions of sizes between portions, etc., are not necessarily the same as the actual values thereof. Further, the dimensions and/or the proportions may be illustrated differently between the drawings, even in the case where the same portion is illustrated.

In the drawings and the specification of the application, components similar to those described in regard to a drawing thereinabove are marked with like reference numerals, and a detailed description is omitted as appropriate.

(First Embodiment)

FIG. 1 is a schematic perspective plan view showing a semiconductor light emitting element according to a first embodiment.

FIG. 2 to FIG. 4 are schematic cross-sectional views showing the semiconductor light emitting element according to the first embodiment.

FIG. 2 shows an A1-A2 cross section of FIG. 1.

FIG. 3 shows a B1-B2 cross section of FIG. 1.

FIG. 4 shows a C1-C2 cross section of FIG. 1.

Some of the components shown in the cross-sectional views of FIG. 2 to FIG. 4 are not shown in the perspective plan view of FIG. 1 for easier viewing of the drawing.

The semiconductor light emitting element 110 according to the embodiment includes a metal layer 40, a first semiconductor layer 10 a, a second semiconductor layer 20 a, a first light emitting layer 30 a, a third semiconductor layer 10 b, a fourth semiconductor layer 20 b, a second light emitting layer 30 b, first to sixth electrodes e1 to e6, and a first inter-element interconnect section 12.

The first semiconductor layer 10 a is separated from the metal layer 40 in a first direction D1.

The first direction D1 from the metal layer 40 toward the first semiconductor layer 10 a is parallel to a Z-axis direction. One direction perpendicular to the Z-axis direction is taken as an X-axis direction. A direction perpendicular to the Z-axis direction and the X-axis direction is taken as a Y-axis direction.

A first stacked body 100 a includes the first semiconductor layer 10 a, the second semiconductor layer 20 a, and the first light emitting layer 30 a. The first semiconductor layer 10 a includes a first region r1, a second region r2, and a third region r3. The second region r2 is separated from the first region r1 in a second direction D2. The second direction D2 intersects the first direction D1. In the example, the second direction D2 is aligned with the X-axis direction. The third region r3 is provided between the first region r1 and the second region r2. The first semiconductor layer 10 a has a first conductivity type. The first region r1, the second region r2, and the third region r3 extend in a third direction D3. The third direction D3 intersects the first direction D1 and the second direction D2. In the example, the third direction D3 is the Y-axis direction.

The second semiconductor layer 20 a is provided between the first region r1 and the metal layer 40 and between the second region r2 and the metal layer 40. The second semiconductor layer 20 a has a second conductivity type. The first light emitting layer 30 a is provided between the first region r1 and the second semiconductor layer 20 a and between the second region r2 and the second semiconductor layer 20 a.

For example, the first conductivity type is an n-type. The second conductivity type is a p-type. The first conductivity type may be the p-type; and the second conductivity type may be the n-type. Hereinbelow, the case is described where the first conductivity type is the n-type and the second conductivity type is the p-type.

In the example of FIG. 1 to FIG. 4, the first semiconductor layer 10 a includes a first region r1 a, a second region r2 a that is separated from the first region r1 a in the second direction D2, a third region r3 a that is provided between the first region r1 a and the second region r2 a, and a third region r3 b that is provided between the first region r1 and the second region r2 a. These regions also are similar to the first region r1, the second region r2, and the third region r3 recited above.

A second stacked body 100 b includes the third semiconductor layer 10 b, the fourth semiconductor layer 20 b, and the second light emitting layer 30 b. The third semiconductor layer 10 b is separated from the metal layer 40 in the first direction D1 and arranged with the first semiconductor layer 10 a in the second direction D2. In the example, a separation trench 13 is provided between the first semiconductor layer 10 a and the third semiconductor layer 10 b. The separation trench 13 may not be between the first semiconductor layer 10 a and the third semiconductor layer 10 b. The third semiconductor layer 10 b includes a fourth region r4, a fifth region r5, and a sixth region r6. The fifth region r5 is separated from the fourth region r4 in the third direction D3. The sixth region r6 is provided between the fourth region r4 and the fifth region r5. The third semiconductor layer 10 b has the first conductivity type. The fourth region r4, the fifth region r5, and the sixth region r6 extend in the second direction D2.

The fourth semiconductor layer 20 b is provided between the fourth region r4 and the metal layer 40 and between the fifth region r5 and the metal layer 40. The fourth semiconductor layer 20 b has the second conductivity type. The second light emitting layer 30 b is provided between the fourth region r4 and the fourth semiconductor layer 20 b and between the fifth region r5 and the fourth semiconductor layer 20 b.

In the example, the third semiconductor layer 10 b includes a fourth region r4 a, a fifth region r5 a that is separated from the fourth region r4 a in the third direction D3, a sixth region r6 a that is provided between the fourth region r4 a and the fifth region r5 a, and a sixth region r6 b that is provided between the fourth region r4 a and the fifth region r5 a. These regions also are similar to the fourth region r4, the fifth region r5, and the sixth region r6 recited above.

The first electrode e1 is provided between the second semiconductor layer 20 a and the metal layer 40 in the first region r1 and is electrically connected to the second semiconductor layer 20 a. The second electrode e2 is provided between the second semiconductor layer 20 a and the metal layer 40 in the second region r2 and is electrically connected to the second semiconductor layer 20 a. The third electrode e3 is provided between the third region r3 and the metal layer 40 and is electrically connected to the third region r3. The first electrode e1 and the second electrode e2 are, for example, p-electrodes. The third electrode e3 is, for example, an n-electrode.

The fourth electrode e4 is provided between the fourth semiconductor layer 20 b and the metal layer 40 in the fourth region r4 and is electrically connected to the fourth semiconductor layer 20 b. The fifth electrode e5 is provided between the fourth semiconductor layer 20 b and the metal layer 40 in the fifth region r5 and is electrically connected to the fourth semiconductor layer 20 b. The sixth electrode e6 is provided between the sixth region r6 and the metal layer 40 and is electrically connected to the sixth region r6. The fourth electrode e4 and the fifth electrode e5 are, for example, p-electrodes. The sixth electrode e6 is, for example, an n-electrode. The arrangement direction of the fourth to sixth electrodes e4 to e6 is different from that of the first to third electrodes e1 to e3 recited above.

In the specification of the application, the “state of being electrically connected” includes the state of multiple conductors being in direct contact. The “state of being electrically connected” includes the state in which another conductor is disposed between multiple conductors and a current flows between the multiple conductors.

The first inter-element interconnect section 12 is provided between the second electrode e2 and the metal layer 40 and between the sixth electrode e6 and the metal layer 40 and electrically connects the second electrode e2 to the sixth electrode e6.

The semiconductor light emitting element 110 further includes a first linking electrode ec1. The first linking electrode ec1 is provided between the second semiconductor layer 20 a and the metal layer 40 and links the first electrode e1 to the second electrode e2. Similarly to the first electrode e1 and the second electrode e2, the first linking electrode ec1 is electrically connected to the second semiconductor layer 20 a. Similarly to the first electrode e1 and the second electrode e2, the first linking electrode ec1 is, for example, a p-electrode.

The semiconductor light emitting element 110 further includes a first supplemental interconnect section 90. The first supplemental interconnect section 90 is provided between the first electrode e1 and the metal layer 40, between the second electrode e2 and the metal layer 40, and between the first linking electrode ec1 and the metal layer 40 and is electrically connected to the first electrode e1, the second electrode e2, and the first linking electrode ec1. Further, the first supplemental interconnect section 90 is electrically connected to the first inter-element interconnect section 12. The current diffusion can be promoted by providing the first supplemental interconnect section 90 for these electrodes. The current diffusion can be promoted by the first supplemental interconnect section 90 without changing the contact resistance between the second semiconductor layer 20 a and the first electrode e1 and between the second semiconductor layer 20 a and the second electrode e2. The current diffusion can be promoted by the first supplemental interconnect section 90 without changing the thicknesses of the first electrode e1 and the second electrode e2 which effect the emitted light reflectance.

A protective metal layer (also called a barrier metal) 70 may be provided for the first electrode e1 and the second electrode e2. Similarly, the protective metal layer 70 may be provided for the fourth electrode e4 and the fifth electrode e5.

As shown in FIG. 1 to FIG. 4, the semiconductor light emitting element 110 further includes a first pad section 14 a and a first pad interconnect section 80. The first pad section 14 a overlaps the metal layer 40 and does not overlap the first semiconductor layer 10 a when projected onto a plane perpendicular to the first direction D1. The first pad interconnect section 80 electrically connects the first pad section 14 a to the third electrode e3. The first pad section 14 a is, for example, an n-side pad.

The semiconductor light emitting element 110 further includes a second linking electrode ec2. The second linking electrode ec2 is provided between the fourth semiconductor layer 20 b and the metal layer 40 and links the fourth electrode e4 to the fifth electrode e5. Similarly to the fourth electrode e4 and the fifth electrode e5, the second linking electrode ec2 is electrically connected to the fourth semiconductor layer 20 b. Similarly to the fourth electrode e4 and the fifth electrode e5, the second linking electrode ec2 is, for example, a p-electrode.

The semiconductor light emitting element 110 further includes a second pad section 14 b and a second pad interconnect section 81. The second pad section 14 b overlaps the metal layer 40 and does not overlap the third semiconductor layer 10 b when projected onto the plane perpendicular to the first direction D1. The second pad interconnect section 81 electrically connects the second pad section 14 b to the fourth electrode e4, the second pad section 14 b to the fifth electrode e5, and the second pad section 14 b to the second linking electrode ec2. The second pad section 14 b is, for example, a p-side pad.

For example, a voltage is applied between the first pad section 14 a and the second pad section 14 b. A current flows in the first stacked body 100 a and the second stacked body 100 b via the first pad interconnect section 80, the first supplemental interconnect section 90, the first inter-element interconnect section 12, and the second pad interconnect section 81. Light is emitted from the first light emitting layer 30 a and the second light emitting layer 30 b due to the current. In the example, the emitted light is emitted from the first semiconductor layer 10 a and third semiconductor layer 10 b side.

In the example, an unevenness 10 ap is provided in the front surface (the light emitting surface) of the first semiconductor layer 10 a; and an unevenness 10 bp is provided in the front surface (the light emitting surface) of the third semiconductor layer 10 b. In other words, an unevenness is provided in the light emitting surface. The light is emitted efficiently to the outside due to the unevenness.

As shown in FIG. 1, the first electrode e1, the second electrode e2, and the third electrode e3 are provided to extend in the third direction D3. The third electrode e3 is provided between the first electrode e1 and the second electrode e2. The first linking electrode ec1 is provided to extend in the second direction D2. The first linking electrode ec1 is linked to the first electrode e1 and the second electrode e2. The first linking electrode ec1 is disposed to oppose an open end ed3 of the third electrode e3. The first electrode e1, the second electrode e2, and the third electrode e3 are provided between the first pad section 14 a and the first linking electrode ec1.

Multiple first electrodes e1 and multiple second electrodes e2 are provided in the example. The multiple first electrodes e1 and the multiple second electrodes e2 are linked in a comb-shaped configuration by the first linking electrode ec1. Multiple third electrodes e3 are provided; and each of the multiple third electrodes e3 is disposed between the first electrode e1 and the second electrode e2. The multiple third electrodes e3 are linked in a comb-shaped configuration by the first pad interconnect section 80.

The fourth electrode e4, the fifth electrode e5, and the sixth electrode e6 are provided to extend in the second direction D2. The sixth electrode e6 is provided between the fourth electrode e4 and the fifth electrode e5. The second linking electrode ec2 is provided to extend in the third direction D3. The second linking electrode ec2 is linked to the fourth electrode e4 and the fifth electrode e5. The second linking electrode ec2 is disposed to oppose an open end ed6 of the sixth electrode e6. The fourth electrode e4, the fifth electrode e5, and the sixth electrode e6 are provided between the second pad section 14 b and the second electrode e2. The first inter-element interconnect section 12 is provided between the second electrode e2 and the fourth to sixth electrodes e4 to e6.

In the example, multiple fourth electrodes e4 and multiple fifth electrodes e5 are provided. The multiple fourth electrodes e4 and the multiple fifth electrodes e5 are linked in a comb-shaped configuration by the second linking electrode ec2. Multiple sixth electrodes e6 are provided. Each of the multiple sixth electrodes e6 is disposed between the fourth electrode e4 and the fifth electrode e5. Multiple first inter-element interconnect sections 12 are provided. The multiple first inter-element interconnect sections 12 are connected respectively to the multiple sixth electrodes e6.

Here, the third electrode e3 and the sixth electrode e6 (the n-electrodes) are formable as single bodies with the interconnect sections, i.e., the first inter-element interconnect section 12, the first supplemental interconnect section 90, the first pad interconnect section 80, and the second pad interconnect section 81.

The semiconductor light emitting element 110 further includes a base body 50, and an insulating layer 60 that is provided between the metal layer 40 and the first inter-element interconnect section 12. The metal layer 40 is provided between the base body 50 and the insulating layer 60.

The semiconductor light emitting element 110 further includes a first inter-element insulation layer 11. The first inter-element insulation layer 11 is provided between the first inter-element interconnect section 12 and a portion of the first semiconductor layer 10 a.

In the description recited above, the first to sixth electrodes e1 to e6 and the first to second linking electrodes ec1 to ec2 include light-reflective materials. For example, these electrodes include at least one of aluminum (Al), silver (Ag), nickel (Ni), gold, or rhodium. Thereby, a high light reflectance is obtained. The first electrode e1, the second electrode e2, the fourth electrode e4, the fifth electrode e5, the first linking electrode ec1, and the second linking electrode ec2 that are illustrated as p-electrodes include, for example, Ag, Ni, a Ag alloy, or a stacked structure of these substances. The third electrode e3 and the sixth electrode e6 that are illustrated as n-electrodes include, for example, Al or an Al alloy.

For example, the first electrode e1, the second electrode e2, and the first linking electrode ec1 are formed by performing heat treatment in an oxygen atmosphere at not less than 250 degrees and not more than 400 degrees (e.g., 300 degrees) for not less than 0.5 minutes and not more than 2 minutes (e.g., 1 minute). The concentration of oxygen of the oxygen atmosphere is, for example, 50% or more. The concentration of nitrogen of the oxygen atmosphere is, for example, 50% or less.

Heat treatment may be performed in an oxygen atmosphere at not less than 250 degrees and not more than 400 degrees (e.g., 300 degrees) for not less than 0.5 minutes and not more than 2 minutes (e.g., 1 minute) after performing heat treatment in a nitrogen atmosphere at not less than 250 degrees and not more than 400 degrees (e.g., 300 degrees) for not less than 0.5 minutes and not more than 2 minutes (e.g., 1 minute). For example, the reflectance becomes high; and the contact properties improve. The materials and heat treatment recited above are applicable to the embodiments described below as well.

Good ohmic characteristics with the second semiconductor layer 20 a are obtained by applying the configuration recited above to the first electrode e1, the second electrode e2, and the first linking electrode ec1. Low contact resistance with the second semiconductor layer 20 a is obtained. Good electrical characteristics and a high light reflectance are obtained. Similar configurations and materials are applicable to the fourth electrode e4, the fifth electrode e5, and the second linking electrode ec2 as well.

For example, the third electrode e3 is formed by performing heat treatment in a nitrogen atmosphere at not less than 300 degrees and not more than 600 degrees (e.g., 400 degrees) for not less than 0.5 minutes and not more than 10 minutes (e.g., 1 minute). The concentration of nitrogen of the nitrogen atmosphere is, for example, 90% or more. An inert gas such as argon, etc., may be used instead of nitrogen. The heat treatment may be at reduced pressure. The heat treatment recited above is applicable to the embodiments described below as well.

Good ohmic characteristics with the first semiconductor layer 10 a are obtained by applying the configuration recited above to the third electrode e3. Low contact resistance with the first semiconductor layer 10 a is obtained. Good electrical characteristics and a high light reflectance are obtained. Similar configurations and materials are applicable to the sixth electrode e6 as well.

The first inter-element interconnect section 12 also includes a light-reflective material. It is favorable for the light reflectance of the first inter-element interconnect section 12 to be higher than the light reflectance of the metal layer 40. For example, the first inter-element interconnect section 12 includes at least one of aluminum, silver, gold, or rhodium. The metal layer 40 includes, for example, tin and at least one of gold or nickel. In other words, by considering the bondability, the metal layer 40 includes metals such as AuSn, NiSn, etc. Thereby, good bondability is obtained.

Further, the first supplemental interconnect section 90, the first pad interconnect section 80, and the second pad interconnect section 81 also include light-reflective materials. At least one of the first supplemental interconnect section 90, the first pad interconnect section 80, or the second pad interconnect section 81 includes, for example, at least one of aluminum, silver, gold, or rhodium.

The light that is emitted from the light emitting layers (the first light emitting layer 30 a and the second light emitting layer 30 b) is reflected efficiently by these electrodes, interconnect sections, etc. The light that is reflected is emitted efficiently to the outside from the light emitting surface. Thereby, a high light extraction efficiency is obtained.

On the other hand, the heat that is generated by the stacked body is dissipated efficiently by the base body 50. The base body 50 includes a material having high thermal conductivity and good heat dissipation. The base body 50 includes, for example, aluminum nitride, silicon, germanium, copper, etc. Thereby, good heat dissipation is obtained; and an excessive increase of the temperature of the stacked body is suppressed. Thereby, a high luminous efficiency is obtained. These materials are applicable to the embodiments described below as well.

The peak wavelength of the light (the emitted light) that is emitted from the light emitting layer is, for example, not less than 400 nm and not more than 650 nm. However, the peak wavelength is arbitrary in the embodiment.

The first semiconductor layer 10 a includes, for example, a GaN layer including an n-type impurity. The n-type impurity can include at least one of Si, Ge, Te, or Sn. The first semiconductor layer 10 a includes, for example, an n-side contact layer. This is similar for the third semiconductor layer 10 b as well.

The second semiconductor layer 20 a includes, for example, a GaN layer including a p-type impurity. The p-type impurity can include at least one of Mg, Zn, or C. The second semiconductor layer 20 a includes, for example, a p-side contact layer. This is similar for the fourth semiconductor layer 20 b as well.

For example, the first stacked body 100 a that includes the first semiconductor layer 10 a, the second semiconductor layer 20 a, and the first light emitting layer 30 a is formed by epitaxial growth. The growth substrate can include, for example, one of Si, sapphire, GaN, SiC, or GaAs. The plane orientation of the growth substrate is arbitrary. This is similar for the second stacked body 100 b as well. These materials are applicable to the embodiments described below as well.

The configuration of each of the first pad section 14 a and the second pad section 14 b is, for example, a polygon (e.g., having five or more sides), a circle, a flattened circle, etc. The width of the pad section is, for example, not less than 50 micrometers (mm) and not more than 200 mm (e.g., 130 mm). For example, a bonding wire is connected to the pad section. A width (size) to which a stable connection can be made is applied.

The insulating layer 60 includes, for example, silicon oxide (Sift, etc.) and/or silicon nitride (Si₃N₄, etc.). For example, the insulating layer 60 is formed at a high temperature. Thereby, good insulative properties, good coverage, and good reliability are obtained for the insulating layer 60. The insulating layer 60 may be formed at a low temperature. By using the insulating layer 60, good spreading of the current is obtained; and the effective light emission surface area can be enlarged. The first inter-element insulation layer 11 also includes, for example, silicon oxide (SiO₂, etc.). These materials are applicable to the embodiments described below as well.

The protective metal layer 70 includes, for example, at least one of platinum (Pt), nickel (Ni), titanium (Ti), or tungsten (W). These materials are applicable to the embodiments described below as well.

In the example, the side surface of a portion of the first stacked body 100 a and the side surface of a portion of the second stacked body 100 b are tilted with respect to the Z-axis direction. In other words, a mesa configuration is applicable. The travel direction of the light can be changed by the mesa configuration. The intensity of the light emitted from the light emitting layer is a maximum in the direction of about 30 degrees. The light that travels at the angle where the intensity of the light is a maximum can be changed efficiently.

According to the embodiment, a so-called multijunction structure can be provided in which the operation at a high voltage and a low current is possible in a semiconductor light emitting element having a lateral-conduction thin film structure. In the embodiment, multiple stacked bodies are connected in series. The appropriate operating voltage of one stacked body is within a prescribed range. By connecting the multiple stacked bodies in series, the voltage that is applied to the two ends of the multiple stacked bodies connected in series is divided among the multiple stacked bodies. Thereby, the voltage that is applied to each of the stacked bodies can be within a desirable prescribed range even in the case where the voltage that is applied to the two ends is a high voltage. Driving by a low current that obtains high efficiency is obtained by the voltage within the desirable prescribed range. In other words, the operation at a high voltage and a low current is obtained for the multiple stacked bodies. Thereby, a high efficiency is obtained for the multiple stacked bodies.

According to the embodiment, one n-electrode is interposed between two p-electrodes in one stacked body (element). At least two such stacked bodies are connected in series. Thereby, the light emission uniformity can be increased.

According to the embodiment, high reliability can be obtained because an inter-layer insulating layer is unnecessary between the p-electrode and the n-electrode. According to the embodiment, good heat dissipation can be obtained.

Further, in the example, a light-shielding object such as an interconnect or the like is not provided on the light extraction surface. Thereby, a high light extraction efficiency is obtained. The inter-element interconnect section is provided not on the light extraction surface side but on the base body side. Thereby, a high light extraction efficiency is obtained. High mountability is obtained due to the pad sections.

In the description recited above, the semiconductor light emitting element 110 includes the first stacked body 100 a and the second stacked body 100 b. For example, as shown in FIG. 1, the sixth electrode e6 (the n-electrode) of the second stacked body 100 b is disposed to be orthogonal to the first electrode e1 and the second electrode e2 (the p-electrodes) of the first stacked body 100 a. The p-electrode and the n-electrode are connected in series via the first inter-element interconnect section 12 between the first stacked body 100 a and the second stacked body 100 b. Thereby, unutilized interconnects can be eliminated. The connection between elements can be made easily.

(Second embodiment)

FIG. 5 is a schematic perspective plan view showing a semiconductor light emitting element according to a second embodiment.

FIG. 6 and FIG. 7 are schematic cross-sectional views showing the semiconductor light emitting element according to the second embodiment.

FIG. 6 shows a D1-D2 cross section of FIG. 5.

FIG. 7 shows an E1-E2 cross section of FIG. 5.

Some of the components shown in the cross-sectional views of FIG. 6 and FIG. 7 are not shown in the perspective plan view of FIG. 5 for easier viewing of the drawing.

The semiconductor light emitting element 111 according to the embodiment includes the metal layer 40, the first semiconductor layer 10 a, the second semiconductor layer 20 a, the first light emitting layer 30 a, the third semiconductor layer 10 b, the fourth semiconductor layer 20 b, the second light emitting layer 30 b, the first to sixth electrodes e1 to e6, and the first inter-element interconnect section 12. The semiconductor light emitting element 111 further includes a fifth semiconductor layer 10 c, a sixth semiconductor layer 20 c, a third light emitting layer 30 c, seventh to ninth electrodes e7 to e9, a third linking electrode ec3, and a second inter-element interconnect section 16.

The fifth semiconductor layer 10 c is separated from the metal layer 40 in the first direction D1 and arranged with the first semiconductor layer 10 a in the third direction D3. In the example, the separation trench 13 is provided between the first semiconductor layer 10 a and the fifth semiconductor layer 10 c. The separation trench 13 may not be between the first semiconductor layer 10 a and the fifth semiconductor layer 10 c.

The first direction D1 from the metal layer 40 toward the fifth semiconductor layer 10 c is parallel to the Z-axis direction. One direction perpendicular to the Z-axis direction is taken as the X-axis direction. A direction perpendicular to the Z-axis direction and the X-axis direction is taken as the Y-axis direction.

A third stacked body 100 c includes the fifth semiconductor layer 10 c, the sixth semiconductor layer 20 c, and the third light emitting layer 30 c. The fifth semiconductor layer 10 c includes a seventh region r7, an eighth region r8, and a ninth region r9. The eighth region r8 is separated from the seventh region r7 in the second direction D2. The second direction D2 intersects the first direction D1. In the example, the second direction D2 is aligned with the X-axis direction. The ninth region r9 is provided between the seventh region r7 and the eighth region r8. The fifth semiconductor layer 10 c has the first conductivity type. The seventh region r7, the eighth region r8, and the ninth region r9 extend in the third direction D3. The third direction D3 intersects the first direction D1 and the second direction D2. In the example, the third direction D3 is the Y-axis direction.

The sixth semiconductor layer 20 c is provided between the seventh region r7 and the metal layer 40 and between the eighth region r8 and the metal layer 40. The sixth semiconductor layer 20 c has the second conductivity type. The third light emitting layer 30 c is provided between the seventh region r7 and the sixth semiconductor layer 20 c and between the eighth region r8 and the sixth semiconductor layer 20 c.

In the example of FIG. 5, the fifth semiconductor layer 10 c includes a seventh region r7 a, an eighth region r8 a that is separated from the seventh region r7 a in the second direction D2, a ninth region r9 a that is provided between the seventh region r7 a and the eighth region r8 a, and a ninth region r9 b that is provided between the seventh region r7 and the eighth region r8 a. These regions also are similar to the seventh region r7, the eighth region r8, and the ninth region r9 recited above.

The seventh electrode e7 is provided between the sixth semiconductor layer 20 c and the metal layer 40 in the seventh region r7 and is electrically connected to the sixth semiconductor layer 20 c. The eighth electrode e8 is provided between the sixth semiconductor layer 20 c and the metal layer 40 in the eighth region r8 and is electrically connected to the sixth semiconductor layer 20 c. The ninth electrode e9 is provided between the ninth region r9 and the metal layer 40 and is electrically connected to the ninth region r9. The seventh electrode e7 and the eighth electrode e8 are, for example, p-electrodes. The ninth electrode e9 is, for example, an n-electrode.

The third linking electrode ec3 is provided between the sixth semiconductor layer 20 c and the metal layer 40 and links the seventh electrode e7 to the eighth electrode e8. Similarly to the seventh electrode e7 and the eighth electrode e8, the third linking electrode ec3 is electrically connected to the sixth semiconductor layer 20 c. Similarly to the seventh electrode e7 and the eighth electrode e8, the third linking electrode ec3 is, for example, a p-electrode.

The second inter-element interconnect section 16 is provided between the third electrode e3 and the metal layer 40 and between the third linking electrode ec3 and the metal layer 40 and electrically connects the third electrode e3 to the third linking electrode ec3.

The semiconductor light emitting element 111 further includes a second supplemental interconnect section 91. The second supplemental interconnect section 91 is provided between the seventh electrode e7 and the metal layer 40, between the eighth electrode e8 and the metal layer 40, and between the third linking electrode ec3 and the metal layer 40 and is electrically connected to the seventh electrode e7, the eighth electrode e8, and the third linking electrode ec3. Further, the second supplemental interconnect section 91 is electrically connected to the second inter-element interconnect section 16.

Similarly to the first electrode e1, the second electrode e2, the fourth electrode e4, and the fifth electrode e5, the protective metal layer 70 may be provided for the seventh electrode e7 and the eighth electrode e8.

As shown in FIG. 5 to FIG. 7, the semiconductor light emitting element 111 further includes a first pad section 14 c and a first pad interconnect section 82. The first pad section 14 c overlaps the metal layer 40 and does not overlap the fifth semiconductor layer 10 c when projected onto the plane perpendicular to the first direction D1. The first pad interconnect section 82 electrically connects the first pad section 14 c to the ninth electrode e9. The first pad section 14 c is, for example, an n-side pad.

The semiconductor light emitting element 111 further includes the second linking electrode ec2. The second linking electrode ec2 is provided between the fourth semiconductor layer 20 b and the metal layer 40 and links the fourth electrode e4 to the fifth electrode e5. Similarly to the fourth electrode e4 and the fifth electrode e5, the second linking electrode ec2 is electrically connected to the fourth semiconductor layer 20 b. Similarly to the fourth electrode e4 and the fifth electrode e5, the second linking electrode ec2 is, for example, a p-electrode.

The semiconductor light emitting element 111 further includes the second pad section 14 b and the second pad interconnect section 81. The second pad section 14 b overlaps the metal layer 40 and does not overlap the third semiconductor layer 10 b when projected onto the plane perpendicular to the first direction D1. The second pad interconnect section 81 electrically connects the second pad section 14 b to the fourth electrode e4, the second pad section 14 b to the fifth electrode e5, and the second pad section 14 b to the second linking electrode ec2. The second pad section 14 b is, for example, a p-side pad.

As shown in FIG. 5, the seventh electrode e7, the eighth electrode e8, and the ninth electrode e9 are provided to extend in the third direction D3. The ninth electrode e9 is provided between the seventh electrode e7 and the eighth electrode e8. The third linking electrode ec3 is provided to extend in the second direction D2. The third linking electrode ec3 is linked to the seventh electrode e7 and the eighth electrode e8. The third linking electrode ec3 is disposed to oppose an open end ed9 of the ninth electrode e9. The seventh electrode e7, the eighth electrode e8, and the ninth electrode e9 are provided between the first pad section 14 c and the third linking electrode ec3. The second inter-element interconnect section 16 is provided between the third linking electrode ec3 and the first to third electrodes e1 to e3.

In the example, multiple seventh electrodes e7 and multiple eighth electrodes e8 are provided. The multiple seventh electrodes e7 and the multiple eighth electrodes e8 are linked in a comb-shaped configuration by the third linking electrode ec3. Multiple ninth electrodes e9 are provided. Each of the multiple ninth electrodes e9 is disposed between the seventh electrode e7 and the eighth electrode e8. The multiple ninth electrodes e9 are linked in a comb-shaped configuration by the first pad interconnect section 82. Multiple second inter-element interconnect sections 16 are provided. The multiple second inter-element interconnect sections 16 are connected respectively to the multiple third electrodes e3.

Here, the third electrode e3, the sixth electrode e6, and the ninth electrode e9 (the n-electrode) are formable as single bodies with the interconnect sections, i.e., the first inter-element interconnect section 12, the second inter-element interconnect section 16, the first supplemental interconnect section 90, the second supplemental interconnect section 91, the first pad interconnect section 82, and the second pad interconnect section 81.

The semiconductor light emitting element 111 further includes the base body 50, and the insulating layer 60 that is provided between the metal layer 40 and the second inter-element interconnect section 16. The metal layer 40 is provided between the base body 50 and the insulating layer 60.

The semiconductor light emitting element 111 further includes a second inter-element insulation layer 15. The second inter-element insulation layer 15 is provided between the second inter-element interconnect section 16 and a portion of the fifth semiconductor layer 10 c. The second inter-element insulation layer 15 includes, for example, silicon oxide (SiO₂, etc.).

FIG. 8A to FIG. 8D are drawings showing portions of the semiconductor light emitting element according to the second embodiment.

FIG. 8A is a schematic perspective plan view in which portion S of FIG. 5 is enlarged.

FIG. 8B is a schematic cross-sectional view showing a T1-T2 cross section of FIG. 8A.

FIG. 8C is a schematic cross-sectional view showing a U1-U2 cross section of FIG. 8A.

FIG. 8D is a schematic cross-sectional view showing a V1-V2 cross section of FIG. 8A.

As shown in FIG. 8A to FIG. 8D, the semiconductor light emitting element 111 further includes a reflective layer 61. The reflective layer 61 is provided partially between the metal layer 40 and the insulating layer 60. The reflective layer 61 includes, for example, Ag or a Ag alloy. The base body 50 is not shown in the example of FIG. 8A to FIG. 8D.

According to the embodiment, at least three stacked bodies are connected in series. Thereby, high light emission uniformity can be obtained. A high light extraction efficiency can be obtained. Thereby, a highly efficient semiconductor light emitting element can be provided.

In the description recited above, the semiconductor light emitting element 111 includes the first stacked body 100 a, the second stacked body 100 b, and the third stacked body 100 c. For example, as shown in FIG. 5, the sixth electrode e6 (the n-electrode) of the second stacked body 100 b is disposed to be orthogonal to the first electrode e1 and the second electrode e2 (the p-electrodes) of the first stacked body 100 a; and the seventh electrode e7 and the eighth electrode e8 (the p-electrodes) of the third stacked body 100 c are disposed to be parallel to the third electrode e3 (the n-electrode) of the first stacked body 100 a. The p-electrode and the n-electrode are connected in series via the first inter-element interconnect section 12 from the first stacked body 100 a to the second stacked body 100 b. Further, the p-electrode and the n-electrode are connected in series via the second inter-element interconnect section 16 from the third stacked body 100 c to the first stacked body 100 a. Thereby, unutilized interconnects can be eliminated. The connection between elements can be made easily.

(Third Embodiment)

FIG. 9 is a schematic perspective plan view showing a semiconductor light emitting element according to a third embodiment.

FIG. 10 and FIG. 11 are schematic cross-sectional views showing the semiconductor light emitting element according to the third embodiment.

FIG. 10 shows an F1-F2 cross section of FIG. 9.

FIG. 11 shows a G1-G2 cross section of FIG. 9.

Some of the components shown in the cross-sectional views of FIG. 10 and FIG. 11 are not shown in the perspective plan view of FIG. 9 for easier viewing of the drawing.

The semiconductor light emitting element 112 according to the embodiment includes the metal layer 40, the first semiconductor layer 10 a, the second semiconductor layer 20 a, the first light emitting layer 30 a, the third semiconductor layer 10 b, the fourth semiconductor layer 20 b, the second light emitting layer 30 b, the first to sixth electrodes e1 to e6, the first inter-element interconnect section 12, the fifth semiconductor layer 10 c, the sixth semiconductor layer 20 c, the third light emitting layer 30 c, the seventh to ninth electrodes e7 to e9, the third linking electrode ec3, and the second inter-element interconnect section 16. The semiconductor light emitting element 112 further includes a seventh semiconductor layer 10 d, an eighth semiconductor layer 20 d, a fourth light emitting layer 30 d, tenth to twelfth electrodes e10 to e12, and a third inter-element interconnect section 18.

The seventh semiconductor layer 10 d is separated from the metal layer 40 in the first direction D1 and is arranged with the third semiconductor layer 10 b in the third direction D3. In the example, the separation trench 13 is provided between the third semiconductor layer 10 b and the seventh semiconductor layer 10 d. The separation trench 13 may not be between the third semiconductor layer 10 b and the seventh semiconductor layer 10 d.

The first direction D1 from the metal layer 40 toward the seventh semiconductor layer 10 d is parallel to the Z-axis direction. One direction perpendicular to the Z-axis direction is taken as the X-axis direction. A direction perpendicular to the Z-axis direction and the X-axis direction is taken as the Y-axis direction.

A fourth stacked body 100 d includes the seventh semiconductor layer 10 d, the eighth semiconductor layer 20 d, and the fourth light emitting layer 30 d. The seventh semiconductor layer 10 d includes a tenth region r10, an eleventh region r11, and a twelfth region r12. The eleventh region r11 is separated from the tenth region r10 in the second direction D2. The second direction D2 intersects the first direction D1. In the example, the second direction D2 is aligned with the X-axis direction. The twelfth region r12 is provided between the tenth region r10 and the eleventh region r11. The seventh semiconductor layer 10 d has the first conductivity type. The tenth region r10, the eleventh region r11, and the twelfth region r12 extend in the third direction D3. The third direction D3 intersects the first direction D1 and the second direction D2. In the example, the third direction D3 is the Y-axis direction.

The eighth semiconductor layer 20 d is provided between the tenth region r10 and the metal layer 40 and between the eleventh region r11 and the metal layer 40. The eighth semiconductor layer 20 d has the second conductivity type. The fourth light emitting layer 30 d is provided between the tenth region r10 and the eighth semiconductor layer 20 d and between the eleventh region r11 and the eighth semiconductor layer 20 d.

In the example of FIG. 9, the seventh semiconductor layer 10 d includes a tenth region r10 a, an eleventh region r11 a that is separated from the tenth region r10 a in the second direction D2, a twelfth region r12 a that is provided between the tenth region r10 a and the eleventh region r11 a, and a twelfth region r12 b that is provided between the tenth region r10 and the eleventh region r11 a. These regions also are similar to the tenth region r10, the eleventh region r11, and the twelfth region r12 recited above.

The tenth electrode e10 is provided between the eighth semiconductor layer 20 d and the metal layer 40 in the tenth region r10 and is electrically connected to the eighth semiconductor layer 20 d. The eleventh electrode e11 is provided between the eighth semiconductor layer 20 d and the metal layer 40 in the eleventh region r11 and is electrically connected to the eighth semiconductor layer 20 d. The twelfth electrode e12 is provided between the twelfth region r12 and the metal layer 40 and is electrically connected to the twelfth region r12. The tenth electrode e10 and the eleventh electrode e11 are, for example, p-electrodes. The twelfth electrode e12 is, for example, an n-electrode.

The third inter-element interconnect section 18 is provided between the fifth electrode e5 and the metal layer 40 and between the twelfth electrode e12 and the metal layer 40 and electrically connects the fifth electrode e5 to the twelfth electrode e12.

The semiconductor light emitting element 112 further includes the second linking electrode ec2 and a third supplemental interconnect section 92. The second linking electrode ec2 is provided between the fourth semiconductor layer 20 b and the metal layer 40 and links the fourth electrode e4 to the fifth electrode e5. Similarly to the fourth electrode e4 and the fifth electrode e5, the second linking electrode ec2 is electrically connected to the fourth semiconductor layer 20 b. Similarly to the fourth electrode e4 and the fifth electrode e5, the second linking electrode ec2 is, for example, a p-electrode. The third supplemental interconnect section 92 is provided between the fourth electrode e4 and the metal layer 40, between the fifth electrode e5 and the metal layer 40, and between the second linking electrode ec2 and the metal layer 40 and is electrically connected to the fourth electrode e4, the fifth electrode e5, and the second linking electrode ec2. Further, the third supplemental interconnect section 92 is electrically connected to the third inter-element interconnect section 18.

Similarly to the first electrode e1, the second electrode e2, the fourth electrode e4, the fifth electrode e5, the seventh electrode e7, and the eighth electrode e8, the protective metal layer 70 may be provided for the tenth electrode e10 and the eleventh electrode e11.

As shown in FIG. 9 to FIG. 11, the semiconductor light emitting element 112 further includes the first pad section 14 c and the first pad interconnect section 82. The first pad section 14 c overlaps the metal layer 40 and does not overlap the fifth semiconductor layer 10 c when projected onto the plane perpendicular to the first direction D1 (referring to FIG. 6). The first pad interconnect section 82 electrically connects the first pad section 14 c to the ninth electrode e9. The first pad section 14 c is, for example, an n-side pad.

The semiconductor light emitting element 112 further includes a second pad section 14 d and a second pad interconnect section 83. The second pad section 14 d overlaps the metal layer 40 and does not overlap the seventh semiconductor layer 10 d when projected onto the plane perpendicular to the first direction D1. The second pad interconnect section 83 electrically connects the second pad section 14 d to the tenth electrode e10, the second pad section 14 d to the eleventh electrode e11, and the second pad section 14 d to a fourth linking electrode ec4. The second pad section 14 d is, for example, a p-side pad.

As shown in FIG. 9, the tenth electrode e10, the eleventh electrode e11, and the twelfth electrode e12 are provided to extend in the third direction D3. The twelfth electrode e12 is provided between the tenth electrode e10 and the eleventh electrode e11. The fourth linking electrode ec4 is provided to extend in the second direction D2. The fourth linking electrode ec4 is linked to the tenth electrode e10 and the eleventh electrode e11. The fourth linking electrode ec4 is disposed to oppose an open end ed12 of the twelfth electrode e12. The tenth electrode e10, the eleventh electrode e11, and the twelfth electrode e12 are provided between the second pad section 14 d and the fifth electrode e5. The third inter-element interconnect section 18 is provided between the fifth electrode e5 and the tenth to twelfth electrodes e10 to e12.

In the example, multiple tenth electrodes e10 and multiple eleventh electrodes e11 are provided. The multiple tenth electrodes e10 and the multiple eleventh electrodes e11 are linked in a comb-shaped configuration by the fourth linking electrode ec4. Multiple twelfth electrodes e12 are provided. Each of the multiple twelfth electrodes e12 is disposed between the tenth electrode e10 and the eleventh electrode e11. Multiple third inter-element interconnect sections 18 are provided. The multiple third inter-element interconnect sections 18 are connected respectively to the multiple twelfth electrodes e12.

Here, the third electrode e3, the sixth electrode e6, the ninth electrode e9, and the twelfth electrode e12 (the n-electrodes) are formable as single bodies with the interconnect sections, i.e., the first inter-element interconnect section 12, the second inter-element interconnect section 16, the third inter-element interconnect section 18, the first supplemental interconnect section 90, the second supplemental interconnect section 91, the third supplemental interconnect section 92, the first pad interconnect section 82, and the second pad interconnect section 83.

The semiconductor light emitting element 112 further includes the base body 50, and the insulating layer 60 that is provided between the metal layer 40 and the third inter-element interconnect section 18. The metal layer 40 is provided between the base body 50 and the insulating layer 60.

The semiconductor light emitting element 112 further includes a third inter-element insulation layer 17. The third inter-element insulation layer 17 is provided between the third inter-element interconnect section 18 and a portion of the seventh semiconductor layer 10 d. The third inter-element insulation layer 17 includes, for example, silicon oxide (SiO₂, etc.).

According to the embodiment, at least four stacked bodies are connected in series. Thereby, high light emission uniformity can be obtained. A high light extraction efficiency can be obtained. Thereby, a highly efficient semiconductor light emitting element can be provided.

In the description recited above, the semiconductor light emitting element 112 includes the first stacked body 100 a, the second stacked body 100 b, the third stacked body 100 c, and the fourth stacked body 100 d. For example, as shown in FIG. 9, the sixth electrode e6 (the n-electrode) of the second stacked body 100 b is disposed to be orthogonal to the first electrode e1 and the second electrode e2 (the p-electrodes) of the first stacked body 100 a; and the seventh electrode e7 and the eighth electrode e8 (the p-electrodes) of the third stacked body 100 c are disposed to be parallel to the third electrode e3 (the n-electrode) of the first stacked body 100 a. Further, the twelfth electrode e12 (the n-electrode) of the fourth stacked body 100 d is disposed to be orthogonal to the fourth electrode e4 and the fifth electrode e5 (the p-electrodes) of the second stacked body 100 b. The p-electrode and the n-electrode are connected in series via the first inter-element interconnect section 12 from the first stacked body 100 a to the second stacked body 100 b. The p-electrode and the n-electrode are connected in series via the second inter-element interconnect section 16 from the third stacked body 100 c to the first stacked body 100 a. Further, the p-electrode and the n-electrode are connected in series via the third inter-element interconnect section 18 from the second stacked body 100 b to the fourth stacked body 100 d. Thereby, unutilized interconnects can be eliminated. The connection between elements can be made easily.

(Fourth Embodiment)

FIG. 12 is a schematic perspective plan view showing a semiconductor light emitting element according to a fourth embodiment.

The semiconductor light emitting element 113 according to the embodiment includes the metal layer 40, the first semiconductor layer 10 a, the second semiconductor layer 20 a, the first light emitting layer 30 a, and the first to third electrodes e1 to e3. The semiconductor light emitting element 113 further includes the fifth semiconductor layer 10 c, the sixth semiconductor layer 20 c, the third light emitting layer 30 c, the seventh to ninth electrodes e7 to e9, the third linking electrode ec3, and the second inter-element interconnect section 16. The cross-sectional structure of the semiconductor light emitting element 113 is similar to those of the semiconductor light emitting element 111 described in the second embodiment and the semiconductor light emitting element 112 described in the third embodiment. Here, the description refers to FIG. 2, FIG. 6, FIG. 7, and FIG. 12.

The first semiconductor layer 10 a is separated from the metal layer 40 in the first direction D1.

The first stacked body 100 a includes the first semiconductor layer 10 a, the second semiconductor layer 20 a, and the first light emitting layer 30 a. The first semiconductor layer 10 a includes the first region r1, the second region r2, and the third region r3. The second region r2 is separated from the first region r1 in the second direction D2. The second direction D2 intersects the first direction D1. In the example, the second direction D2 is aligned with the X-axis direction. The third region r3 is provided between the first region r1 and the second region r2. The first semiconductor layer 10 a has the first conductivity type. The first region r1, the second region r2, and the third region r3 extend in the third direction D3. The third direction D3 intersects the first direction D1 and the second direction D2. In the example, the third direction D3 is the Y-axis direction.

The second semiconductor layer 20 a is provided between the first region r1 and the metal layer 40 and between the second region r2 and the metal layer 40. The second semiconductor layer 20 a has the second conductivity type. The first light emitting layer 30 a is provided between the first region r1 and the second semiconductor layer 20 a and between the second region r2 and the second semiconductor layer 20 a.

The fifth semiconductor layer 10 c is separated from the metal layer 40 in the first direction D1 and is arranged with the first semiconductor layer 10 a in the third direction D3. In the example, the separation trench 13 is provided between the first semiconductor layer 10 a and the fifth semiconductor layer 10 c. The separation trench 13 may not be between the first semiconductor layer 10 a and the fifth semiconductor layer 10 c.

The first direction D1 from the metal layer 40 toward the fifth semiconductor layer 10 c is parallel to the Z-axis direction. One direction perpendicular to the Z-axis direction is taken as the X-axis direction. A direction perpendicular to the Z-axis direction and the X-axis direction is taken as the Y-axis direction.

The third stacked body 100 c includes the fifth semiconductor layer 10 c, the sixth semiconductor layer 20 c, and the third light emitting layer 30 c. The fifth semiconductor layer 10 c includes the seventh region r7, the eighth region r8, and the ninth region r9. The eighth region r8 is separated from the seventh region r7 in the second direction D2. The second direction D2 intersects the first direction D1. In the example, the second direction D2 is aligned with the X-axis direction. The ninth region r9 is provided between the seventh region r7 and the eighth region r8. The fifth semiconductor layer 10 c has the first conductivity type. The seventh region r7, the eighth region r8, and the ninth region r9 extend in the third direction D3. The third direction D3 intersects the first direction D1 and the second direction D2. In the example, the third direction D3 is the Y-axis direction.

The sixth semiconductor layer 20 c is provided between the seventh region r7 and the metal layer 40 and between the eighth region r8 and the metal layer 40. The sixth semiconductor layer 20 c has the second conductivity type. The third light emitting layer 30 c is provided between the seventh region r7 and the sixth semiconductor layer 20 c and between the eighth region r8 and the sixth semiconductor layer 20 c.

The first electrode e1 is provided between the second semiconductor layer 20 a and the metal layer 40 in the first region r1 and is electrically connected to the second semiconductor layer 20 a. The second electrode e2 is provided between the second semiconductor layer 20 a and the metal layer 40 in the second region r2 and is electrically connected to the second semiconductor layer 20 a. The third electrode e3 is provided between the third region r3 and the metal layer 40 and is electrically connected to the third region r3. The first electrode e1 and the second electrode e2 are, for example, p-electrodes. The third electrode e3 is, for example, an n-electrode.

The seventh electrode e7 is provided between the sixth semiconductor layer 20 c and the metal layer 40 in the seventh region r7 and is electrically connected to the sixth semiconductor layer 20 c. The eighth electrode e8 is provided between the sixth semiconductor layer 20 c and the metal layer 40 in the eighth region r8 and is electrically connected to the sixth semiconductor layer 20 c. The ninth electrode e9 is provided between the ninth region r9 and the metal layer 40 and is electrically connected to the ninth region r9. The seventh electrode e7 and the eighth electrode e8 are, for example, p-electrodes. The ninth electrode e9 is, for example, an n-electrode.

The third linking electrode ec3 is provided between the sixth semiconductor layer 20 c and the metal layer 40 and links the seventh electrode e7 to the eighth electrode e8. Similarly to the seventh electrode e7 and the eighth electrode e8, the third linking electrode ec3 is electrically connected to the sixth semiconductor layer 20 c. Similarly to the seventh electrode e7 and the eighth electrode e8, the third linking electrode ec3 is, for example, a p-electrode.

The second inter-element interconnect section 16 is provided between the third electrode e3 and the metal layer 40 and between the third linking electrode ec3 and the metal layer 40 and electrically connects the third electrode e3 to the third linking electrode ec3.

The semiconductor light emitting element 113 further includes the second supplemental interconnect section 91. The second supplemental interconnect section 91 is provided between the seventh electrode e7 and the metal layer 40, between the eighth electrode e8 and the metal layer 40, and between the third linking electrode ec3 and the metal layer 40 and is electrically connected to the seventh electrode e7, the eighth electrode e8, and the third linking electrode ec3. Further, the second supplemental interconnect section 91 is electrically connected to the second inter-element interconnect section 16.

The semiconductor light emitting element 113 further includes the first pad section 14 c and the first pad interconnect section 82. The first pad section 14 c overlaps the metal layer 40 and does not overlap the fifth semiconductor layer 10 c when projected onto the plane perpendicular to the first direction D1. The first pad interconnect section 82 electrically connects the first pad section 14 c to the ninth electrode e9. The first pad section 14 c is, for example, an n-side pad.

The semiconductor light emitting element 113 further includes the first linking electrode ec1. The first linking electrode ec1 is provided between the second semiconductor layer 20 a and the metal layer 40 and links the first electrode e1 to the second electrode e2. Similarly to the first electrode e1 and the second electrode e2, the first linking electrode ec1 is electrically connected to the second semiconductor layer 20 a. Similarly to the first electrode e1 and the second electrode e2, the first linking electrode ec1 is, for example, a p-electrode.

The semiconductor light emitting element 113 further includes a second pad section 14 e and a second pad interconnect section 84. The second pad section 14 e overlaps the metal layer 40 and does not overlap the first semiconductor layer 10 a when projected onto the plane perpendicular to the first direction D1. The second pad interconnect section 84 electrically connects the second pad section 14 e to the first electrode e1, the second pad section 14 e to the second electrode e2, and the second pad section 14 e to the first linking electrode ec1. The second pad section 14 e is, for example, a p-side pad.

As shown in FIG. 12, the seventh electrode e7, the eighth electrode e8, and the ninth electrode e9 are provided to extend in the third direction D3. The ninth electrode e9 is provided between the seventh electrode e7 and the eighth electrode e8. The third linking electrode ec3 is provided to extend in the second direction D2. The third linking electrode ec3 is linked to the seventh electrode e7 and the eighth electrode e8. The third linking electrode ec3 is disposed to oppose the open end ed9 of the ninth electrode e9. The seventh electrode e7, the eighth electrode e8, and the ninth electrode e9 are provided between the first pad section 14 c and the third linking electrode ec3. The second inter-element interconnect section 16 is provided between the third linking electrode ec3 and the first to third electrodes e1 to e3.

According to the embodiment, at least two stacked bodies are connected in series. Thereby, high light emission uniformity can be obtained. A high light extraction efficiency can be obtained. Thereby, a highly efficient semiconductor light emitting element can be provided.

FIG. 13A to FIG. 13E are schematic plan views showing electrodes and interconnects of the semiconductor light emitting element according to the embodiment.

FIG. 13A to FIG. 13E show the state in which the semiconductor light emitting element 112 according to the third embodiment is disassembled into each layer and are drawings showing the disposition of the electrodes and the interconnects in the case where four (two by two) stacked bodies are connected in series.

FIG. 13A shows the disposition of the p-electrodes. As shown in FIG. 13A, the first electrode e1, the second electrode e2, and the first linking electrode ec1 are disposed in the first stacked body 100 a. The fourth electrode e4, the fifth electrode e5, and the second linking electrode ec2 are disposed in the second stacked body 100 b. The seventh electrode e7, the eighth electrode e8, and the third linking electrode ec3 are disposed in the third stacked body 100 c. The tenth electrode e10, the eleventh electrode e11, and the fourth linking electrode ec4 are disposed in the fourth stacked body 100 d.

FIG. 13B shows the disposition of the n-electrodes. As shown in FIG. 13B, the third electrode e3 is disposed in the first stacked body 100 a. The sixth electrode e6 is disposed in the second stacked body 100 b. The ninth electrode e9 is disposed in the third stacked body 100 c. The twelfth electrode e12 is disposed in the fourth stacked body 100 d.

FIG. 13C shows the disposition of the interconnects. As shown in FIG. 13C, the second inter-element interconnect section 16 and the first supplemental interconnect section 90 are disposed in the first stacked body 100 a. The first inter-element interconnect section 12 and the third supplemental interconnect section 92 are disposed in the second stacked body 100 b. The second supplemental interconnect section 91 and the first pad interconnect section 82 are disposed in the third stacked body 100 c. The third inter-element interconnect section 18 and the second pad interconnect section 83 are disposed in the fourth stacked body 100 d.

FIG. 13D shows the disposition of a mesa. As shown in FIG. 13D, the mesa 19 is formed in the element electrode plane.

FIG. 13E shows the disposition of the separation trench. As shown in FIG. 13E, the separation trench 13 is formed in the element front surface.

FIG. 14A to FIG. 14E are schematic plan views showing electrodes and interconnects of one other semiconductor light emitting element according to the embodiment.

FIG. 14A to FIG. 14E show the state in which the one other semiconductor light emitting element according to the embodiment is disassembled into each layer and are drawings showing the disposition of the electrodes and the interconnects in the case where nine (three by three) stacked bodies are connected in series.

Similarly to the example of FIG. 13A to FIG. 13E recited above, FIG. 14A shows the disposition of the p-electrodes. FIG. 14B shows the disposition of the n-electrodes. FIG. 14C shows the disposition of the interconnects. FIG. 14D shows the disposition of the mesa. FIG. 14E shows the disposition of the separation trench.

Thus, in the semiconductor light emitting element of the embodiment, the basic disposition is similar to the case of four stacked bodies even in the case where nine stacked bodies are connected in series. Therefore, the number of stacked bodies is not particularly limited.

FIG. 15A and FIG. 15B are schematic plan views showing the interconnect structure of another semiconductor light emitting element according to the embodiment.

FIG. 15A is a drawing showing the interconnect structure of the semiconductor light emitting element including nine (three by three) stacked bodies.

FIG. 15B is a drawing in which portion W of FIG. 15A is enlarged.

As shown in FIG. 15A and FIG. 15B, the first stacked body 100 a and the third stacked body 100 c are arranged in the third direction D3. In the first stacked body 100 a, an electrode pa that is on the p-side includes the first electrode e1, the second electrode e2, and the first linking electrode ec1. The first electrode e1 and a second electrode ep2 extend in the third direction D3. The first linking electrode ec1 extends in the second direction D2 and links the first electrode e1 to the second electrode e2.

An electrode na that is on the n-side includes the two third electrodes e3 and e3 b and a fifth linking electrode ec5. The two third electrodes e3 and e3 b extend in the third direction D3. The fifth linking electrode ec5 extends in the second direction D2 and links the two third electrodes e3 and e3 b.

Similarly, in the third stacked body 100 c, an electrode pb that is on the p-side includes the seventh electrode e7, the eighth electrode e8, and the third linking electrode ec3. The seventh electrode e7 and the eighth electrode e8 extend in the third direction D3. The third linking electrode ec3 extends in the second direction D2 and links the seventh electrode e7 to the eighth electrode e8.

An electrode nb that is on the n-side includes the two ninth electrodes e9 and e9 b and a sixth linking electrode ec6. The two ninth electrodes e9 and e9 b extend in the third direction D3. The sixth linking electrode ec6 extends in the second direction D2 and links the two ninth electrodes e9 and e9 b.

In the case of the example, a supplemental interconnect section is not provided for the p-electrodes pa and pb. An inter-element interconnect section 21 is used as the inter-element connection between the first stacked body 100 a and the third stacked body 100 c. The inter-element interconnect section 21 does not have a line configuration such as that of the second inter-element interconnect section 16 described above (FIG. 5) but has a broad plate configuration. Thereby, the resistance can be reduced. The inter-element interconnect section 21 is provided to extend in the second direction D2 between the first stacked body 100 a and the third stacked body 100 c when projected onto the plane perpendicular to the first direction D1.

The fifth linking electrode ec5 and the inter-element interconnect section 21 are electrically connected. The third linking electrode ec3 and the inter-element interconnect section 21 are electrically connected. Thus, the n-electrode of the first stacked body 100 a and the p-electrode of the third stacked body 100 c are connected in series. The number of stacked bodies to which the interconnect structure of the example is applicable is not limited to nine (three by three). The basic cross-sectional structure is as described in the first to fourth embodiments described above.

FIG. 16A and FIG. 16B are schematic plan views showing interconnect structures of another semiconductor light emitting element according to the embodiment.

FIG. 16A is a drawing showing an interconnect structure of the semiconductor light emitting element including four (two by two) stacked bodies.

FIG. 16B is a drawing showing another interconnect structure of the semiconductor light emitting element including four (two by two) stacked bodies.

The interconnect structure shown in FIG. 16A is similar to the interconnect structure described in the third embodiment described above (FIG. 9). In other words, the first stacked body 100 a and the third stacked body 100 c are arranged in the third direction D3. In the third stacked body 100 c, the eighth electrode e8 that is on the p-side extends in the third direction D3. The eighth electrode e8 includes an extension portion e81 extending in the second direction D2. The two ninth electrodes e9 and e9 b that are on the n-side extend in the third direction D3. The ninth electrode e9 and the ninth electrode e9 b are linked by a seventh linking electrode ec7. The seventh linking electrode ec7 extends in the second direction and is connected to the first pad section 14 c. The extension portion e81 is provided between the separation trench 13 and the seventh linking electrode ec7 when projected onto the plane perpendicular to the first direction D1. In other words, in the third direction D3, the n-electrode (the seventh linking electrode ec7) is disposed inside the p-electrode (the extension portion e81 of the eighth electrode e8).

On the other hand, in the interconnect structure shown in FIG. 16B, the n-electrode (the seventh linking electrode ec7) is disposed on the outside. In other words, in the third stacked body 100 c, the eighth electrode e8 that is on the p-side extends in the third direction D3 but does not extend in the second direction D2. The two ninth electrodes e9 and e9 b that are on the n-side extend in the third direction D3. The ninth electrode e9 and the ninth electrode e9 b are linked by the seventh linking electrode ec7. The seventh linking electrode ec7 extends in the second direction and is connected to the first pad section 14 c. When projected onto the plane perpendicular to the first direction D1, the seventh linking electrode ec7 is disposed to be arranged with the separation trench 13, and the extension portion e81 of the eighth electrode e8 does not exist between the separation trench 13 and the seventh linking electrode ec7. In the third direction D3, the n-electrode (the seventh linking electrode ec7) is disposed outside the p-electrode (the eighth electrode e8). The embodiment may have the interconnect structure of either FIG. 16A or FIG. 16B. Compared to the interconnect structure of FIG. 16A, the interconnect structure of FIG. 16B is favorable in that there are few unutilized interconnects.

FIG. 17A to FIG. 17H and FIG. 18A to FIG. 18E are schematic cross-sectional views showing a method for manufacturing the semiconductor light emitting element according to the embodiment.

Here, the D1-D2 cross section of FIG. 5 (referring to FIG. 6) is shown in the description.

As shown in FIG. 17A, a buffer layer 52 is formed on a growth substrate 51; and a first semiconductor film 10 f, a light emitting film 30 f, and a second semiconductor film 20 f are sequentially formed in this order on the buffer layer 52. For example, metal-organic chemical vapor deposition (Metal-Organic Chemical Vapor Deposition: MOCVD), metal-organic vapor phase epitaxy (Metal-Organic Vapor Phase Epitaxy: MOVPE), molecular beam epitaxy (Molecular Beam Epitaxy: MBE), hydride vapor phase epitaxy (HVPE), etc., can be used to form these films. These films are epitaxially grown. The growth substrate 51 includes, for example, a substrate of silicon, sapphire, spinel, GaAs, InP, ZnO, Ge, SiGe, SiC, etc.

As shown in FIG. 17B, the first stacked body 100 a and the third stacked body 100 c are formed by removing a portion of the first semiconductor film 10 f, a portion of the light emitting film 30 f, and a portion of the second semiconductor film 20 f. The first stacked body 100 a includes the first semiconductor layer 10 a, the second semiconductor layer 20 a, and the first light emitting layer 30 a. The third stacked body 100 c includes the fifth semiconductor layer 10 c, the sixth semiconductor layer 20 c, and the third light emitting layer 30 c. For example, RIE (Reactive Ion Etching) is used in the patterning of the removal. For example, a gas that includes chlorine is used in the RIE. The first semiconductor layer 10 a and the fifth semiconductor layer 10 c are continuous at this time and are separated in a process described below.

As shown in FIG. 17C, an insulating film 15 f is formed on the stacked body. For example, CVD (Chemical Vapor Deposition), sputtering, SOG (Spin On Glass), or the like is used for the insulating film 15 f. The insulating film 15 f includes, for example, silicon oxide such as SiO₂, etc.

The insulating film 15 f is patterned as shown in FIG. 17D. The second inter-element insulation layer 15 is formed from the insulating film 15 f. A portion of the insulating film 15 f is removed; and the first linking electrode ec1 and the third linking electrode ec3 that are on the p-side are formed respectively on the second semiconductor layer 20 a and the sixth semiconductor layer 20 c that are exposed. The protective metal layer 70 (not shown) may be formed for the first linking electrode ec1 and the third linking electrode ec3 as necessary.

As shown in FIG. 17E, a portion of the insulating film 15 f is removed; and the third electrode e3 and the ninth electrode e9 that are on the n-side are formed respectively on the first semiconductor layer 10 a and the fifth semiconductor layer 10 c that are exposed.

As shown in FIG. 17F, the first supplemental interconnect section 90, the second supplemental interconnect section 91, the first pad interconnect section 82, and the second inter-element interconnect section 16 are formed. These interconnect sections may be formed simultaneously with the n-side electrodes (the third electrode e3 and the ninth electrode e9) recited above.

The insulating layer 60 is formed as shown in FIG. 17G. For example, CVD, sputtering, SOG, or the like is used for the insulating layer 60. The insulating layer 60 includes, for example, silicon oxide such as SiO₂, etc.

As shown in FIG. 17H, the reflective layer 61 that is made of a metal is formed on the insulating layer 60. The reflective layer 61 includes, for example, Ag or a Ag alloy.

As shown in FIG. 18A, a support unit 50 u is prepared. The support unit 50 u includes the base body 50 and the metal layer 40. The metal layer 40 is disposed between the base body 50 and the stacked body. The reflective layer 61 and the base body 50 are bonded by the metal layer 40 by heating.

The growth substrate 51 and the buffer layer 52 are removed as shown in FIG. 18B.

An unevenness 10 p is formed in the upper surface of the first semiconductor film 10 f as shown in FIG. 18C.

As shown in FIG. 18D, the first semiconductor layer 10 a and the fifth semiconductor layer 10 c are formed by dividing the first semiconductor film 10 f. Thereby, the separation trench 13 is made.

As shown in FIG. 18E, the first pad section 14 c is formed. Thereby, the semiconductor light emitting element 111 is formed.

(Fifth Embodiment)

FIG. 19 to FIG. 22 are schematic cross-sectional views showing a semiconductor light emitting element according to a fifth embodiment.

FIG. 19 shows another example of the A1-A2 cross section of FIG. 1.

FIG. 20 is a drawing in which portion W1 of FIG. 19 is enlarged.

FIG. 21 shows another example of the B1-B2 cross section of FIG. 1.

FIG. 22 shows another example of the C1-C2 cross section of FIG. 1.

As shown in the example of FIG. 19 to FIG. 22, the cross-sectional structure of the p-electrode periphery of the semiconductor light emitting element 114 is different from that of the semiconductor light emitting element 110. The first supplemental interconnect section 90 and a portion of the first electrode e1 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the first supplemental interconnect section 90 and a portion of the second electrode e2 overlap. The first supplemental interconnect section 90 and a portion of the first linking electrode ec1 overlap. The width of the first supplemental interconnect section 90 is narrower than the width of each of these electrodes. For example, the first supplemental interconnect section 90 is provided in a line configuration.

As shown in FIG. 20, the protective metal layer 70 covers the second electrode e2. Each of the end portions of the protective metal layer 70 is provided on an insulating layer 11 a. The insulating layer 11 a is the insulating layer formed at the mesa portion. For example, silicon oxide (Sift, etc.) is used as the material of the insulating layer 11 a. The material is applicable to each of the embodiments. The peripheral structures of the first electrode e1, the first linking electrode ec1, the fourth electrode e4, the fifth electrode e5, and the second linking electrode ec2 are similar to the peripheral structure of the second electrode e2 shown in FIG. 20.

The second pad interconnect section 81 and a portion of the fourth electrode e4 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the second pad interconnect section 81 and a portion of the fifth electrode e5 overlap. The second pad interconnect section 81 and a portion of the second linking electrode ec2 overlap. The width of the second pad interconnect section 81 is narrower than the width of each of these electrodes. For example, the second pad interconnect section 81 is provided in a line configuration.

As shown in FIG. 22, the protective metal layer 70 covers the second electrode e2. One end of the two end portions of the protective metal layer 70 is provided on the insulating layer 11 a; and the other end is provided on the first inter-element insulation layer 11.

(Sixth Embodiment)

FIG. 23 and FIG. 24 are schematic cross-sectional views showing a semiconductor light emitting element according to a sixth embodiment.

FIG. 23 shows another example of the D1-D2 cross section of FIG. 5.

FIG. 24 shows another example of the E1-E2 cross section of FIG. 5.

As shown in the example of FIG. 23 and FIG. 24, the cross-sectional structure of the p-electrode periphery of the semiconductor light emitting element 115 is different from that of the semiconductor light emitting element 111. The second supplemental interconnect section 91 and a portion of the seventh electrode e7 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the second supplemental interconnect section 91 and a portion of the eighth electrode e8 overlap. The second supplemental interconnect section 91 and a portion of the third linking electrode ec3 overlap. The width of the second supplemental interconnect section 91 is narrower than the width of each of these electrodes. For example, the second supplemental interconnect section 91 is provided in a line configuration.

The peripheral structures of the seventh electrode e7, the eighth electrode e8, and the third linking electrode ec3 are similar to the peripheral structure of the second electrode e2 shown in FIG. 20.

FIG. 25A to FIG. 25D are drawings showing a portion of the semiconductor light emitting element according to the sixth embodiment.

FIG. 25A is a schematic perspective plan view in which portion S of FIG. 5 is enlarged.

FIG. 25B is a schematic cross-sectional view showing another example of the T1-T2 cross section of FIG. 25A.

FIG. 25C is a schematic cross-sectional view showing another example of the U1-U2 cross section of FIG. 25A.

FIG. 25D is a schematic cross-sectional view showing another example of the V1-V2 cross section of FIG. 25A.

(Seventh Embodiment)

FIG. 26 and FIG. 27 are schematic cross-sectional views showing a semiconductor light emitting element according to a seventh embodiment.

FIG. 26 shows another example of the F1-F2 cross section of FIG. 9.

FIG. 27 shows another example of the G1-G2 cross section of FIG. 9.

As shown in the examples of FIG. 26 and FIG. 27, the cross-sectional structure of the p-electrode periphery of the semiconductor light emitting element 116 is different from that of the semiconductor light emitting element 112. The third supplemental interconnect section 92 and a portion of the fourth electrode e4 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the third supplemental interconnect section 92 and a portion of the fifth electrode e5 overlap. The third supplemental interconnect section 92 and a portion of the second linking electrode ec2 overlap. The width of the third supplemental interconnect section 92 is narrower than the width of each of these electrodes. For example, the third supplemental interconnect section 92 is provided in a line configuration.

The peripheral structures of the tenth electrode e10, the eleventh electrode e11, and the fourth linking electrode ec4 are similar to the peripheral structure of the second electrode e2 shown in FIG. 20.

The second pad interconnect section 83 and a portion of the tenth electrode e10 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the second pad interconnect section 83 and a portion of the eleventh electrode e11 overlap. The second pad interconnect section 83 and a portion of the fourth linking electrode ec4 overlap. The width of the second pad interconnect section 83 is narrower than the width of each of these electrodes. For example, the second pad interconnect section 83 is provided in a line configuration.

Similarly to the description recited above, the structure of the p-electrode periphery of the semiconductor light emitting element 113 shown in the example of FIG. 12 may be different. The second supplemental interconnect section 91 and a portion of the seventh electrode e7 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the second supplemental interconnect section 91 and a portion of the eighth electrode e8 overlap. The second supplemental interconnect section 91 and a portion of the third linking electrode ec3 overlap. The width of the second supplemental interconnect section 91 is narrower than the width of each of these electrodes. For example, the second supplemental interconnect section 91 is provided in a line configuration.

The second pad interconnect section 84 and a portion of the first electrode e1 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the second pad interconnect section 84 and a portion of the second electrode e2 overlap. The second pad interconnect section 84 and a portion of the first linking electrode ec1 overlap. The width of the second pad interconnect section 84 is narrower than the width of each of these electrodes. For example, the second pad interconnect section 84 is provided in a line configuration.

As shown in FIG. 17F, the first supplemental interconnect section 90, the second supplemental interconnect section 91, the first pad interconnect section 82, and the second inter-element interconnect section 16 are formed. For example, vapor deposition and lift-off are used as the method for forming these interconnect sections.

(Eighth Embodiment)

FIG. 28 is a schematic perspective plan view showing a semiconductor light emitting element according to an eighth embodiment.

FIG. 29A and FIG. 29B are schematic cross-sectional views showing the semiconductor light emitting element according to the eighth embodiment.

FIG. 29A shows an A1-A2 cross section of FIG. 28. FIG. 29B is a drawing in which portion W2 of FIG. 29A is enlarged.

FIG. 30 is a schematic cross-sectional view showing the semiconductor light emitting element according to the eighth embodiment.

FIG. 30 shows a B1-B2 cross section of FIG. 28.

FIG. 31A and FIG. 31B are schematic cross-sectional views showing the semiconductor light emitting element according to the eighth embodiment.

FIG. 31A shows a C1-C2 cross section of FIG. 28. FIG. 31B is a drawing in which portion W3 of FIG. 31A is enlarged.

Some of the components shown in the cross-sectional views of FIG. 29A, FIG. 29B, FIG. 30, FIG. 31A, and FIG. 31B are not shown in the perspective plan view of FIG. 28 for easier viewing of the drawing.

The semiconductor light emitting element 117 according to the embodiment includes a first supplemental interconnect section 90 a and a second pad interconnect section 81 a. In the example, each of these interconnect sections are provided in a planar configuration. In other words, the first supplemental interconnect section 90 a and the entire first electrode e1 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the first supplemental interconnect section 90 a and the entire second electrode e2 overlap. The first supplemental interconnect section 90 a and the entire first linking electrode ec1 overlap. The width of the first supplemental interconnect section 90 a is wider than the width of each of these electrodes. The second pad interconnect section 81 a and the entire fourth electrode e4 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the second pad interconnect section 81 a and the entire fifth electrode e5 overlap. The second pad interconnect section 81 a and the entire second linking electrode ec2 overlap. The width of the second pad interconnect section 81 a is wider than the width of each of these electrodes. The first electrode e1, the second electrode e2, the first linking electrode ec1, the fourth electrode e4, the fifth electrode e5, and the second linking electrode ec2 are p-electrodes.

The semiconductor light emitting element 117 has a structure in which the pad interconnect and the supplemental interconnect on the p-electrode entirely cover the p-electrode and the n-electrode. The unevenness on the p-electrode is eliminated due to the p-electrode being entirely covered. Also, sputtering and etching can be used easily as the method for forming the supplemental interconnect and the pad interconnect due to the p-electrode and the n-electrode being entirely covered.

The semiconductor light emitting element 117 further includes a first pad interconnect section 80 a and a first inter-element interconnect section 12 a. The first pad interconnect section 80 a is formed separately from the third electrode e3 and covers the entire surface (including the side surface) of the third electrode e3. The first inter-element interconnect section 12 a is formed separately from the sixth electrode e6 and covers the entire surface of the sixth electrode e6. The third electrode e3 and the sixth electrode e6 are n-electrodes. In the embodiment, it is favorable for the thickness of the n-electrode to be controlled. Thereby, it is possible to planarize the unevenness of the bonding surface with the metal layer 40.

In the example, as shown in FIG. 29B, the protective metal layer 70 covers the second electrode e2. Each of the end portions of the protective metal layer 70 is provided on the insulating layer 11 a. The insulating layer 11 a is an insulating layer formed at the mesa portion. The first supplemental interconnect section 90 a covers the protective metal layer 70. Each of the end portions of the first supplemental interconnect section 90 a is provided on the insulating layer 11 a. The peripheral structures of the first electrode e1, the first linking electrode ec1, the fourth electrode e4, the fifth electrode e5, and the second linking electrode ec2 are similar to the peripheral structure of the second electrode e2 shown in FIG. 21B. The first pad interconnect section 80 a covers the third electrode e3. Each of the end portions of the first pad interconnect section 80 a is provided on the insulating layer 11 a.

As shown in FIG. 31B, the protective metal layer 70 covers the second electrode e2. One end of the two end portions of the protective metal layer 70 is provided on the insulating layer 11 a; and the other end is provided on the first inter-element insulation layer 11. The first supplemental interconnect section 90 a is linked to the first inter-element interconnect section 12 a. The first supplemental interconnect section 90 a covers the protective metal layer 70. One end of the two end portions of the first supplemental interconnect section 90 a is provided on the insulating layer 11 a; and the other end is provided on the first inter-element insulation layer 11.

In the embodiment, it is possible to form the protective metal layer 70 and the first supplemental interconnect section 90 a as a single body.

(Ninth Embodiment)

FIG. 32 is a schematic perspective plan view showing a semiconductor light emitting element according to a ninth embodiment.

FIG. 33 and FIG. 34 are schematic cross-sectional views showing the semiconductor light emitting element according to the ninth embodiment.

FIG. 33 shows a D1-D2 cross section of FIG. 32.

FIG. 34 shows an E1-E2 cross section of FIG. 32.

Some of the components shown in the cross-sectional views of FIG. 33 and FIG. 34 are not shown in the perspective plan view of FIG. 32 for easier viewing of the drawing.

The semiconductor light emitting element 118 according to the embodiment includes the first supplemental interconnect section 90 a, a second supplemental interconnect section 91 a, and the second pad interconnect section 81 a. In the example, each of these interconnect sections is provided in a planar configuration. The first supplemental interconnect section 90 a and the second pad interconnect section 81 a are as described in the eighth embodiment. The second supplemental interconnect section 91 a and the entire seventh electrode e7 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the second supplemental interconnect section 91 a and the entire eighth electrode e8 overlap. The second supplemental interconnect section 91 a and the entire third linking electrode ec3 overlap. The width of the second supplemental interconnect section 91 a is wider than the width of each of these electrodes. The seventh electrode e7, the eighth electrode e8, and the third linking electrode ec3 are p-electrodes.

The semiconductor light emitting element 118 has a structure in which the pad interconnect and the supplemental interconnect on the p-electrode entirely cover the p-electrode and the n-electrode. The unevenness on the p-electrode is eliminated due to the p-electrode being entirely covered. Also, sputtering and etching can be used easily as the method for forming the supplemental interconnect and the pad interconnect due to the p-electrode and the n-electrode being entirely covered.

The semiconductor light emitting element 118 further includes a first pad interconnect section 82 a, the first inter-element interconnect section 12 a, and a second inter-element interconnect section 16 a. The first inter-element interconnect section 12 a is as described in the fifth embodiment. The first pad interconnect section 82 a is formed separately from the ninth electrode e9 and covers the entire surface of the ninth electrode e9. The second inter-element interconnect section 16 a is formed separately from the third electrode e3 and covers the entire surface of the third electrode e3. The ninth electrode e9 and the third electrode e3 are n-electrodes. In the embodiment, it is favorable for the thickness of the n-electrode to be controlled. Thereby, it is possible to planarize the unevenness of the bonding surface with the metal layer 40.

(Tenth Embodiment)

FIG. 35 is a schematic perspective plan view showing a semiconductor light emitting element according to a tenth embodiment.

FIG. 36 and FIG. 37 are schematic cross-sectional views showing the semiconductor light emitting element according to the tenth embodiment.

FIG. 36 shows an F1-F2 cross section of FIG. 35.

FIG. 37 shows a G1-G2 cross section of FIG. 35.

Some of the components shown in the cross-sectional views of FIG. 36 and FIG. 37 are not shown in the perspective plan view of FIG. 35 for easier viewing of the drawing.

The semiconductor light emitting element 119 according to the embodiment includes the first supplemental interconnect section 90 a, the second supplemental interconnect section 91 a, a third supplemental interconnect section 92 a, and a second pad interconnect section 83 a. In the example, each of these interconnect sections is provided in a planar configuration. The first supplemental interconnect section 90 a and the second supplemental interconnect section 91 a are as described in the eighth and ninth embodiments. The third supplemental interconnect section 92 a and the entire fourth electrode e4 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the third supplemental interconnect section 92 a and the entire fifth electrode e5 overlap. The third supplemental interconnect section 92 a and the entire second linking electrode ec2 overlap. The width of the third supplemental interconnect section 92 a is wider than the width of each of these electrodes. The second pad interconnect section 83 a and the entire tenth electrode e10 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the second pad interconnect section 83 a and the entire eleventh electrode e11 overlap. The second pad interconnect section 83 a and the entire fourth linking electrode ec4 overlap. The width of the second pad interconnect section 83 a is wider than the width of each of these electrodes. The tenth electrode e10, the eleventh electrode e11, and the fourth linking electrode ec4 are p-electrodes.

The semiconductor light emitting element 119 has a structure in which the pad interconnect and the supplemental interconnect on the p-electrode entirely cover the p-electrode and the n-electrode. The unevenness on the p-electrode is eliminated due to the p-electrode being entirely covered. Also, sputtering and etching can be used easily as the method for forming the supplemental interconnect and the pad interconnect due to the p-electrode and the n-electrode being entirely covered.

The semiconductor light emitting element 119 further includes the first pad interconnect section 82 a, the first inter-element interconnect section 12 a, the second inter-element interconnect section 16 a, and a third inter-element interconnect section 18 a. The first pad interconnect section 82 a, the first inter-element interconnect section 12 a, and the second inter-element interconnect section 16 a are as described in the eighth and ninth embodiments. The third inter-element interconnect section 18 a is formed separately from the twelfth electrode e12 and covers the entire surface of the twelfth electrode e12. The twelfth electrode e12 is an n-electrode. In the embodiment, it is favorable for the thickness of the n-electrode to be controlled. Thereby, it is possible to planarize the unevenness of the bonding surface with the metal layer 40.

(Eleventh Embodiment)

FIG. 38 is a schematic perspective plan view showing a semiconductor light emitting element according to an eleventh embodiment.

The semiconductor light emitting element 120 according to the embodiment includes the second supplemental interconnect section 91 a and a second pad interconnect section 84 a. Each of these interconnect sections is provided in a planar configuration. In other words, the second supplemental interconnect section 91 a and the entire seventh electrode e7 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the second supplemental interconnect section 91 a and the entire eighth electrode e8 overlap. The second supplemental interconnect section 91 a and the entire third linking electrode ec3 overlap. The width of the second supplemental interconnect section 91 a is wider than the width of each of these electrodes. The second pad interconnect section 84 a and the entire first electrode e1 overlap when projected onto the plane perpendicular to the first direction D1. Similarly, the second pad interconnect section 84 a and the entire second electrode e2 overlap. The second pad interconnect section 84 a and the entire first linking electrode ec1 overlap. The width of the second pad interconnect section 84 a is wider than the width of each of these electrodes. The seventh electrode e7, the eighth electrode e8, the third linking electrode ec3, the first electrode e1, the second electrode e2, and the first linking electrode ec1 are p-electrodes.

The semiconductor light emitting element 120 has a structure in which the pad interconnect and the supplemental interconnect on the p-electrode entirely cover the p-electrode and the n-electrode. The unevenness on the p-electrode is eliminated due to the p-electrode being entirely covered. Also, sputtering and etching can be used easily as the method for forming the supplemental interconnect and the pad interconnect due to the p-electrode and the n-electrode being entirely covered.

The semiconductor light emitting element 120 further includes the first pad interconnect section 82 a and the second inter-element interconnect section 16 a. The first pad interconnect section 82 a is formed separately from the ninth electrode e9 and covers the entire surface of the ninth electrode e9. The second inter-element interconnect section 16 a is formed separately from the third electrode e3 and covers the entire surface of the third electrode e3. The ninth electrode e9 and the third electrode e3 are n-electrodes. In the embodiment, it is favorable for the thickness of the n-electrode to be controlled. Thereby, it is possible to planarize the unevenness of the bonding surface with the metal layer 40.

According to the embodiments, a highly efficient semiconductor light emitting element can be provided.

In the specification, “nitride semiconductor” includes all compositions of semiconductors of the chemical formula B_(x)In_(y)Al_(z)Ga_(1−x−y−z)N (0 &pound; x &pound; 1, 0 &pound; y &pound; 1, 0 &pound; z &pound; 1, and x+y+z &pound; 1) for which the composition ratios x, y, and z are changed within the ranges respectively. “Nitride semiconductor” further includes group V elements other than N (nitrogen) in the chemical formula recited above, various elements added to control various properties such as the conductivity type and the like, and various elements included unintentionally.

Hereinabove, embodiments of the invention are described with reference to specific examples. However, the invention is not limited to these specific examples. For example, one skilled in the art may similarly practice the invention by appropriately selecting specific configurations of components included in the semiconductor light emitting element such as the metal layers, the semiconductor layers, the light emitting layers, the electrodes, the inter-element interconnect section, etc., from known art; and such practice is within the scope of the invention to the extent that similar effects can be obtained.

Further, any two or more components of the specific examples may be combined within the extent of technical feasibility and are included in the scope of the invention to the extent that the purport of the invention is included.

Moreover, all semiconductor light emitting elements practicable by an appropriate design modification by one skilled in the art based on the semiconductor light emitting elements described above as embodiments of the invention also are within the scope of the invention to the extent that the spirit of the invention is included.

Various other variations and modifications can be conceived by those skilled in the art within the spirit of the invention, and it is understood that such variations and modifications are also encompassed within the scope of the invention.

While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the invention.

REFERENCE SIGNS LIST

10 a . . . first semiconductor layer, 10 b . . . third semiconductor layer, 10 c . . . fifth semiconductor layer, 10 d . . . seventh semiconductor layer, 10 f . . . first semiconductor film, 10 ap,10 bp,10 p . . . unevenness, 11 . . . first inter-element insulation layer, 11 a . . . insulating layer, 12,12 a . . . first inter-element interconnect section, 13 . . . separation trench, 14 a,14 c . . . first pad section, 14 b,14 d,14 e . . . second pad section, 15 . . . second inter-element insulation layer, 15 f . . . insulating film, 16,16 a . . . second inter-element interconnect section, 17 . . . third inter-element insulation layer, 18,18 a . . . third inter-element interconnect section, 19 . . . mesa, 20 a . . . second semiconductor layer, 20 b . . . fourth semiconductor layer, 20 c . . . sixth semiconductor layer, 20 d . . . eighth semiconductor layer, 20 f . . . second semiconductor film, 21 . . . inter-element interconnect section, 30 a to 30 d . . . first to fourth light emitting layer, 30 f . . . light emitting film, 40 . . . metal layer, 50 . . . base body 50 u . . . support unit, 51 . . . growth substrate, 52 . . . buffer layer, 60 . . . insulating layer, 61 . . . reflective layer, 70 . . . protective metal layer, 80,80 a,82,82 a . . . first pad interconnect section, 81,81 a,83,83 a,84,84 a . . . second pad interconnect section, 90,90 a . . . first supplemental interconnect section, 91,91 a . . . second supplemental interconnect section, 92,92 a . . . third supplemental interconnect section, 100 a to 100 d . . . first to fourth stacked body, 110 to 113,114 to 120 . . . semiconductor light emitting element, e1 to e12 . . . first to twelfth electrode, ec1 to ec7 . . . first to seventh linking electrode, r1 to r12 . . . first to twelfth region 

The invention claimed is:
 1. A semiconductor light emitting element, comprising: a metal layer; a first semiconductor layer of a first conductivity type separated from the metal layer in the first direction, the first semiconductor layer including a first region, a second region, and a third region, the second region being separated from the first region in a second direction intersecting the first direction, the first region, the second region, and the third region extending in a third direction intersecting the first direction and the second direction, the third region being provided between the first region and the second region; a second semiconductor layer of a second conductivity type provided between the first region and the metal layer and between the second region and the metal layer; a first light emitting layer provided between the first region and the second semiconductor layer and between the second region and the second semiconductor layer; a third semiconductor layer of the first conductivity type separated from the metal layer in the first direction and arranged with the first semiconductor layer in the second direction, the third semiconductor layer including a fourth region, a fifth region, and a sixth region, the fifth region being separated from the fourth region in the third direction, the fourth region, the fifth region, and the sixth region extending in the second direction, the sixth region being provided between the fourth region and the fifth region; a fourth semiconductor layer of the second conductivity type provided between the fourth region and the metal layer and between the fifth region and the metal layer; a second light emitting layer provided between the fourth region and the fourth semiconductor layer and between the fifth region and the fourth semiconductor layer; a first electrode provided between the second semiconductor layer and the metal layer in the first region and electrically connected to the second semiconductor layer; a second electrode provided between the second semiconductor layer and the metal layer in the second region and electrically connected to the second semiconductor layer; a third electrode provided between the third region and the metal layer and electrically connected to the third region; a fourth electrode provided between the fourth semiconductor layer and the metal layer in the fourth region and electrically connected to the fourth semiconductor layer; a fifth electrode provided between the fourth semiconductor layer and the metal layer in the fifth region and electrically connected to the fourth semiconductor layer; a sixth electrode provided between the sixth region and the metal layer and electrically connected to the sixth region; and a first inter-element interconnect section provided between the second electrode and the metal layer and between the sixth electrode and the metal layer, the first inter-element interconnect section electrically connecting the second electrode to the sixth electrode.
 2. The semiconductor light emitting element according to claim 1, further comprising a first linking electrode provided between the second semiconductor layer and the metal layer, the first linking electrode linking the first electrode to the second electrode.
 3. The semiconductor light emitting element according to claim 2, further comprising a first supplemental interconnect section provided between the first electrode and the metal layer, between the second electrode and the metal layer, and between the first linking electrode and the metal layer, the first supplemental interconnect section being electrically connected to the first electrode, the second electrode, and the first linking electrode.
 4. The semiconductor light emitting element according to claim 1, further comprising: a first pad section overlapping the metal layer and not overlapping the first semiconductor layer when projected onto a plane perpendicular to the first direction; and a first pad interconnect section electrically connecting the first pad section to the third electrode.
 5. The semiconductor light emitting element according to claim 1, further comprising a second linking electrode provided between the fourth semiconductor layer and the metal layer, the second linking electrode linking the fourth electrode to the fifth electrode.
 6. The semiconductor light emitting element according to claim 5, further comprising: a second pad section overlapping the metal layer and not overlapping the third semiconductor layer when projected onto a plane perpendicular to the first direction; and a second pad interconnect section electrically connecting the second pad section to the fourth electrode, the second pad section to the fifth electrode, and the second pad section to the second linking electrode.
 7. The semiconductor light emitting element according to claim 1, further comprising: a fifth semiconductor layer of the first conductivity type separated from the metal layer in the first direction and arranged with the first semiconductor layer in the third direction, the fifth semiconductor layer including a seventh region, an eighth region, and a ninth region, the eighth region being separated from the seventh region in the second direction, the seventh region, the eighth region, and the ninth region extending in the third direction, the ninth region being provided between the seventh region and the eighth region; a sixth semiconductor layer of the second conductivity type provided between the seventh region and the metal layer and between the eighth region and the metal layer; a third light emitting layer provided between the seventh region and the sixth semiconductor layer and between the eighth region and the sixth semiconductor layer; a seventh electrode provided between the sixth semiconductor layer and the metal layer in the seventh region, the seventh electrode being electrically connected to the sixth semiconductor layer; an eighth electrode provided between the sixth semiconductor layer and the metal layer in the eighth region and electrically connected to the sixth semiconductor layer; a ninth electrode provided between the ninth region and the metal layer and electrically connected to the ninth region; a third linking electrode provided between the sixth semiconductor layer and the metal layer, the third linking electrode linking the seventh electrode to the eighth electrode; and a second inter-element interconnect section provided between the third electrode and the metal layer and between the third linking electrode and the metal layer, the second inter-element interconnect section electrically connecting the third electrode to the third linking electrode.
 8. The semiconductor light emitting element according to claim 7, further comprising a second supplemental interconnect section provided between the seventh electrode and the metal layer, between the eighth electrode and the metal layer, and between the third linking electrode and the metal layer, the second supplemental interconnect section being electrically connected to the seventh electrode, the eighth electrode, and the third linking electrode.
 9. The semiconductor light emitting element according to claim 7, further comprising: a first pad section overlapping the metal layer and not overlapping the fifth semiconductor layer when projected onto a plane perpendicular to the first direction; and a first pad interconnect section electrically connecting the first pad section to the ninth electrode.
 10. The semiconductor light emitting element according to claim 7, further comprising: a second linking electrode provided between the fourth semiconductor layer and the metal layer, the second linking electrode linking the fourth electrode to the fifth electrode; a second pad section overlapping the metal layer and not overlapping the third semiconductor layer when projected onto a plane perpendicular to the first direction; and a second pad interconnect section electrically connecting the second pad section to the fourth electrode, the second pad section to the fifth electrode, and the second pad section to the second linking electrode.
 11. The semiconductor light emitting element according to claim 7, further comprising: a seventh semiconductor layer of the first conductivity type separated from the metal layer in the first direction and arranged with the third semiconductor layer in the third direction, the seventh semiconductor layer including a tenth region, an eleventh region, and a twelfth region, the eleventh region being separated from the tenth region in the second direction, the tenth region, the eleventh region, and the twelfth region extending in the third direction, the twelfth region being provided between the tenth region and the eleventh region; an eighth semiconductor layer of the second conductivity type provided between the tenth region and the metal layer and between the eleventh region and the metal layer; a fourth light emitting layer provided between the tenth region and the eighth semiconductor layer and between the eleventh region and the eighth semiconductor layer; a tenth electrode provided between the eighth semiconductor layer and the metal layer in the tenth region and electrically connected to the eighth semiconductor layer; an eleventh electrode provided between the eighth semiconductor layer and the metal layer in the eleventh region and electrically connected to the eighth semiconductor layer; a twelfth electrode provided between the twelfth region and the metal layer and electrically connected to the twelfth region; and a third inter-element interconnect section provided between the fifth electrode and the metal layer and between the twelfth electrode and the metal layer, the third inter-element interconnect section electrically connecting the fifth electrode to the twelfth electrode.
 12. The semiconductor light emitting element according to claim 11, further comprising: a second linking electrode provided between the fourth semiconductor layer and the metal layer, the second linking electrode linking the fourth electrode to the fifth electrode; and a third supplemental interconnect section provided between the fourth electrode and the metal layer, between the fifth electrode and the metal layer, and between the second linking electrode and the metal layer, the third supplemental interconnect section being electrically connected to the fourth electrode, the fifth electrode, and the second linking electrode.
 13. The semiconductor light emitting element according to claim 11, further comprising: a first pad section overlapping the metal layer and not overlapping the fifth semiconductor layer when projected onto a plane perpendicular to the first direction; and a first pad interconnect section electrically connecting the first pad to the ninth electrode.
 14. The semiconductor light emitting element according to claim 11, further comprising a fourth linking electrode provided between the eighth semiconductor layer and the metal layer, the fourth linking electrode linking the tenth electrode to the eleventh electrode.
 15. The semiconductor light emitting element according to claim 14, further comprising: a second pad section overlapping the metal layer and not overlapping the seventh semiconductor layer when projected onto a plane perpendicular to the first direction; and a second pad interconnect section electrically connecting the second pad section to the tenth electrode, the second pad section to the eleventh electrode, and the second pad section to the fourth linking electrode.
 16. The semiconductor light emitting element according to claim 1, further comprising: a base body; and an insulating layer provided between the metal layer and the first inter-element interconnect section, the metal layer being provided between the base body and the insulating layer.
 17. The semiconductor light emitting element according to claim 16, further comprising a reflective layer provided partially between the metal layer and the insulating layer.
 18. The semiconductor light emitting element according to claim 1, further comprising a first inter-element insulation layer provided between the first inter-element interconnect section and a portion of the first semiconductor layer.
 19. The semiconductor light emitting element according to claim 1, wherein a light reflectance of the first inter-element interconnect section is higher than the light reflectance of the metal layer.
 20. A semiconductor light emitting element, comprising: a metal layer; a first semiconductor layer of a first conductivity type separated from the metal layer in a first direction, the first semiconductor layer including a first region, a second region, and a third region, the second region being separated from the first region in a second direction intersecting the first direction, the first region, the second region, and the third region extending in a third direction intersecting the first direction and the second direction, the third region being provided between the first region and the second region; a second semiconductor layer of a second conductivity type provided between the first region and the metal layer and between the second region and the metal layer; a first light emitting layer provided between the first region and the second semiconductor layer and between the second region and the second semiconductor layer; a fifth semiconductor layer of the first conductivity type separated from the metal layer in the first direction and arranged with the first semiconductor layer in the third direction, the fifth semiconductor layer including a seventh region, an eighth region, and a ninth region, the eighth region being separated from the seventh region in the second direction, the seventh region, the eighth region, and the ninth region extending in the third direction, the ninth region being provided between the seventh region and the eighth region; a sixth semiconductor layer of the second conductivity type provided between the seventh region and the metal layer and between the eighth region and the metal layer; a third light emitting layer provided between the seventh region and the sixth semiconductor layer and between the eighth region and the sixth semiconductor layer; a first electrode provided between the second semiconductor layer and the metal layer in the first region and electrically connected to the second semiconductor layer; a second electrode provided between the second semiconductor layer and the metal layer in the second region and electrically connected to the second semiconductor layer; a third electrode provided between the third region and the metal layer and electrically connected to the third region; a seventh electrode provided between the sixth semiconductor layer and the metal layer in the seventh region and electrically connected to the sixth semiconductor layer; an eighth electrode provided between the sixth semiconductor layer and the metal layer in the eighth region and electrically connected to the sixth semiconductor layer; a ninth electrode provided between the ninth region and the metal layer and electrically connected to the ninth region; a third linking electrode provided between the sixth semiconductor layer and the metal layer, the third linking electrode linking the seventh electrode to the eighth electrode; and a second inter-element interconnect section provided between the third electrode and the metal layer and between the third linking electrode and the metal layer, the second inter-element interconnect section electrically connecting the third electrode to the third linking electrode. 